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Daw Don CHEAM
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Singapore, SG
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last 30 patents
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Through silicon interposer wafer and method of manufacturing the same
Patent number
10,882,737
Issue date
Jan 5, 2021
Agency for Science, Technology and Research
Navab Singh
B81 - MICRO-STRUCTURAL TECHNOLOGY
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last 30 patents
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Patent Application
A THROUGH SILICON INTERPOSER WAFER AND METHOD OF MANUFACTURING THE...
Publication number
20190084826
Publication date
Mar 21, 2019
Agency for Science, Technology and Research
Navab SINGH
B81 - MICRO-STRUCTURAL TECHNOLOGY