Dawn Hopper

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Programmable latency count to achieve higher memory bandwidth
- Patent number 9,477,619
- Issue date Oct 25, 2016
- Qamrul Hasan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit with contact region and multiple etch stop insul...
- Patent number 7,977,797
- Issue date Jul 12, 2011
- Spansion LLC
- Wenmei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor formation method that utilizes multiple etch stop layers
- Patent number 7,572,727
- Issue date Aug 11, 2009
- Spansion LLC
- Wenmei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact and nitride spacer formation system and method
- Patent number 7,361,587
- Issue date Apr 22, 2008
- Spansion, LLC
- Wenmei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory with data retention liner
- Patent number 7,297,592
- Issue date Nov 20, 2007
- Spansion LLC
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of charge trapping dielectric flash memory devices from...
- Patent number 7,118,967
- Issue date Oct 10, 2006
- Spansion, LLC
- Minh V. Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with improved barrier layer adhesion
- Patent number 7,071,562
- Issue date Jul 4, 2006
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method for reducing standing waves in a photoresist
- Patent number 7,070,911
- Issue date Jul 4, 2006
- Advanced Micro Devices, Inc.
- Dawn Hopper
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for preventing an increase in contact hole width during cont...
- Patent number 7,005,387
- Issue date Feb 28, 2006
- Advanced Micro Devices, Inc.
- Dawn Hopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash NVROM devices with UV charge immunity
- Patent number 6,969,654
- Issue date Nov 29, 2005
- Advanced Micro Devices, Inc.
- Tuan Duc Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser thermal annealing to eliminate oxide voiding
- Patent number 6,900,121
- Issue date May 31, 2005
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic spin-on anti-reflective coating over inorganic anti-reflect...
- Patent number 6,867,063
- Issue date Mar 15, 2005
- Advanced Micro Devices, Inc.
- Kouros Ghandehari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowable-doped HDP film
- Patent number 6,809,402
- Issue date Oct 26, 2004
- Advanced Micro Devices, Inc.
- Dawn Hopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation trench fill process
- Patent number 6,806,165
- Issue date Oct 19, 2004
- Advanced Micro Devices, Inc.
- Dawn M. Hopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner for semiconductor memories and manufacturing method therefor
- Patent number 6,803,265
- Issue date Oct 12, 2004
- FASL LLC
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phosphine treatment of low dielectric constant materials in semicon...
- Patent number 6,784,095
- Issue date Aug 31, 2004
- Advanced Micro Devices, Inc.
- Suzette K. Pangrle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of sic for preventing copper contamination of low-k dielectric...
- Patent number 6,756,672
- Issue date Jun 29, 2004
- Advanced Micro Devices, Inc.
- Lu You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnects with improved barrier layer adhesion
- Patent number 6,723,634
- Issue date Apr 20, 2004
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with dual nature capping/arc layers on organi...
- Patent number 6,713,874
- Issue date Mar 30, 2004
- Advanced Micro Devices, Inc.
- Dawn M. Hopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra low deposition rate PECVD silicon nitride
- Patent number 6,686,232
- Issue date Feb 3, 2004
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of SiO2/Sin for preventing copper contamination of low-k dielec...
- Patent number 6,677,679
- Issue date Jan 13, 2004
- Advanced Micro Devices, Inc.
- Lu You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene with silicon carbide middle etch stop layer/ARC
- Patent number 6,656,830
- Issue date Dec 2, 2003
- Advanced Micro Devices, Inc.
- Ramkumar Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory with controlled wordline width
- Patent number 6,653,190
- Issue date Nov 25, 2003
- Advanced Micro Devices, Inc.
- Jean Y. Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with improved barrier layer adhesion
- Patent number 6,645,853
- Issue date Nov 11, 2003
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method for adhesion improvement at an interface between...
- Patent number 6,642,619
- Issue date Nov 4, 2003
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BPSG, SA-CVD liner/P-HDP gap fill
- Patent number 6,613,657
- Issue date Sep 2, 2003
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask removal process including isolation dielectric refill
- Patent number 6,607,925
- Issue date Aug 19, 2003
- Advanced Micro Devices, Inc.
- Unsoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch process for nonhomogenous film
- Patent number 6,599,839
- Issue date Jul 29, 2003
- Advanced Micro Devices, Inc.
- Calvin T. Gabriel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of sion for preventing copper contamination of dielectric layer
- Patent number 6,576,982
- Issue date Jun 10, 2003
- Advanced Micro Devices, Inc.
- Lu You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with dual nature capping/ARC layers on fluori...
- Patent number 6,576,545
- Issue date Jun 10, 2003
- Advanced Micro Devices, Inc.
- Dawn M. Hopper
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Programmable Latency Count to Achieve Higher Memory Bandwidth
- Publication number 20140365744
- Publication date Dec 11, 2014
- Qamrul HASAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CONTACT FORMATION SYSTEM AND METHOD
- Publication number 20090294969
- Publication date Dec 3, 2009
- Wenmei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for preventing an increase in contact hole width during cont...
- Publication number 20050101148
- Publication date May 12, 2005
- Advanced Micro Devices, Inc.
- Dawn Hopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects with improved barrier layer adhesion
- Publication number 20040063310
- Publication date Apr 1, 2004
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of forming low resistance vias
- Publication number 20020162736
- Publication date Nov 7, 2002
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMASCENE PROCESSING EMPLOYING LOW SI-SION ETCH STOP LAYER/ARC
- Publication number 20020123217
- Publication date Sep 5, 2002
- Ramkumar Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for characterizing and reducing adverse effects of texture...
- Publication number 20010053600
- Publication date Dec 20, 2001
- Guarionex Morales
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLUTION FLOW-IN FOR UNIFORM DEPOSITION OF SPIN-ON FILMS
- Publication number 20010029111
- Publication date Oct 11, 2001
- Advanced Micro Devices, Inc.
- LU YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING PLANAR SPIN-ON FILMS
- Publication number 20010001407
- Publication date May 24, 2001
- LU YOU
- H01 - BASIC ELECTRIC ELEMENTS

Dawn Hopper

Person

Patents Grantslast 30 patents

Programmable latency count to achieve higher memory bandwidth

Integrated circuit with contact region and multiple etch stop insul...

Semiconductor formation method that utilizes multiple etch stop layers

Semiconductor contact and nitride spacer formation system and method

Semiconductor memory with data retention liner

Protection of charge trapping dielectric flash memory devices from...

Interconnects with improved barrier layer adhesion

Structure and method for reducing standing waves in a photoresist

Method for preventing an increase in contact hole width during cont...

Flash NVROM devices with UV charge immunity

Laser thermal annealing to eliminate oxide voiding

Organic spin-on anti-reflective coating over inorganic anti-reflect...

Reflowable-doped HDP film

Isolation trench fill process

Liner for semiconductor memories and manufacturing method therefor

Phosphine treatment of low dielectric constant materials in semicon...

Use of sic for preventing copper contamination of low-k dielectric...

Method of forming interconnects with improved barrier layer adhesion

Semiconductor devices with dual nature capping/arc layers on organi...

Ultra low deposition rate PECVD silicon nitride

Use of SiO2/Sin for preventing copper contamination of low-k dielec...

Dual damascene with silicon carbide middle etch stop layer/ARC

Flash memory with controlled wordline width

Interconnects with improved barrier layer adhesion

System and method for adhesion improvement at an interface between...

BPSG, SA-CVD liner/P-HDP gap fill

Hard mask removal process including isolation dielectric refill

Plasma etch process for nonhomogenous film

Use of sion for preventing copper contamination of dielectric layer

Semiconductor devices with dual nature capping/ARC layers on fluori...

Patents Applicationslast 30 patents

Programmable Latency Count to Achieve Higher Memory Bandwidth

SEMICONDUCTOR CONTACT FORMATION SYSTEM AND METHOD

Method for preventing an increase in contact hole width during cont...

Interconnects with improved barrier layer adhesion

Method of forming low resistance vias

DAMASCENE PROCESSING EMPLOYING LOW SI-SION ETCH STOP LAYER/ARC

Methods for characterizing and reducing adverse effects of texture...

SOLUTION FLOW-IN FOR UNIFORM DEPOSITION OF SPIN-ON FILMS

APPARATUS FOR MANUFACTURING PLANAR SPIN-ON FILMS