Daxin Mao

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device containing hydrogen diffusion barri...
- Patent number 10,354,956
- Issue date Jul 16, 2019
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier memory device with through-stack peripheral contact via...
- Patent number 10,269,620
- Issue date Apr 23, 2019
- SanDisk Technologies LLC
- Jixin Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Through-memory-level via structures between staircase regions in a...
- Patent number 10,256,248
- Issue date Apr 9, 2019
- SanDisk Technologies LLC
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Within-array through-memory-level via structures and method of maki...
- Patent number 10,249,640
- Issue date Apr 2, 2019
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having L-shaped word lines and a su...
- Patent number 10,217,746
- Issue date Feb 26, 2019
- SanDisk Technologies LLC
- Tae-Kyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device containing discrete silicon nitride...
- Patent number 10,115,732
- Issue date Oct 30, 2018
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices containing inter-tier dummy memory...
- Patent number 10,056,399
- Issue date Aug 21, 2018
- SanDisk Technologies LLC
- Xiying Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulb-shaped memory stack structures for direct source contact in th...
- Patent number 10,008,570
- Issue date Jun 26, 2018
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a staircase in a semiconductor device using a lin...
- Patent number 9,985,046
- Issue date May 29, 2018
- SanDisk Technologies LLC
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned isolation dielectric structures for a three-dimensiona...
- Patent number 9,859,363
- Issue date Jan 2, 2018
- SanDisk Technologies LLC
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a multilevel memory stack structure using a cavity...
- Patent number 9,853,043
- Issue date Dec 26, 2017
- SanDisk Technologies LLC
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier replacement memory stack structure integration scheme
- Patent number 9,728,551
- Issue date Aug 8, 2017
- SanDisk Technologies LLC
- Ching-Huang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming 3D memory cells after word line replacement
- Patent number 9,716,101
- Issue date Jul 25, 2017
- SanDisk Technologies LLC
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices containing memory block bridges
- Patent number 9,679,906
- Issue date Jun 13, 2017
- SanDisk Technologies LLC
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device with peripheral devices under dummy...
- Patent number 9,673,213
- Issue date Jun 6, 2017
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device with epitaxial semiconductor pedest...
- Patent number 9,543,318
- Issue date Jan 10, 2017
- SanDisk Technologies LLC
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device with epitaxial semiconductor pedest...
- Patent number 9,449,987
- Issue date Sep 20, 2016
- SanDisk Technologies LLC
- Koji Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Closed-loop control for effective pad conditioning
- Patent number 8,337,279
- Issue date Dec 25, 2012
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Grant
Method and composition for electrochemically polishing a conductive...
- Patent number 7,879,255
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Huyen Karen Tran
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and composition for conductive material removal by electroc...
- Patent number 7,582,564
- Issue date Sep 1, 2009
- Applied Materials, Inc.
- Zhihong Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for reduced wear polishing pad conditioning
- Patent number 7,210,988
- Issue date May 1, 2007
- Applied Materials, Inc.
- Yan Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HYDROGEN DIFFUSION BARRI...
- Publication number 20190214344
- Publication date Jul 11, 2019
- SanDisk Technologies LLC
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES CONTAINING INTER-TIER DUMMY MEMORY...
- Publication number 20180182771
- Publication date Jun 28, 2018
- SanDisk Technologies LLC
- Xiying Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULB-SHAPED MEMORY STACK STRUCTURES FOR DIRECT SOURCE CONTACT IN TH...
- Publication number 20180122906
- Publication date May 3, 2018
- SanDisk Technologies LLC
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A STAIRCASE IN A SEMICONDUCTOR DEVICE USING A LIN...
- Publication number 20170358594
- Publication date Dec 14, 2017
- SanDisk Technologies LLC
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WITHIN-ARRAY THROUGH-MEMORY-LEVEL VIA STRUCTURES AND METHOD OF MAKI...
- Publication number 20170358593
- Publication date Dec 14, 2017
- SanDisk Technologies LLC
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MEMORY-LEVEL VIA STRUCTURES BETWEEN STAIRCASE REGIONS IN A...
- Publication number 20170352678
- Publication date Dec 7, 2017
- SanDisk Technologies LLC
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE CONTAINING DISCRETE SILICON NITRIDE...
- Publication number 20170243879
- Publication date Aug 24, 2017
- SANDISK TECHNOLOGIES INC.
- Jixin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER MEMORY DEVICE WITH THROUGH-STACK PERIPHERAL CONTACT VIA...
- Publication number 20170236746
- Publication date Aug 17, 2017
- SanDisk Technologies LLC
- Jixin YU
- G11 - INFORMATION STORAGE
Information Patent Application
SELF-ALIGNED ISOLATION DIELECTRIC STRUCTURES FOR A THREE-DIMENSIONA...
- Publication number 20170236896
- Publication date Aug 17, 2017
- SanDisk Technologies LLC
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER REPLACEMENT MEMORY STACK STRUCTURE INTEGRATION SCHEME
- Publication number 20170229472
- Publication date Aug 10, 2017
- SANDISK TECHNOLOGIES INC.
- Ching-Huang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A MULTILEVEL MEMORY STACK STRUCTURE USING A CAVITY...
- Publication number 20170062454
- Publication date Mar 2, 2017
- SANDISK TECHNOLOGIES INC.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES CONTAINING MEMORY BLOCK BRIDGES
- Publication number 20170047334
- Publication date Feb 16, 2017
- SANDISK TECHNOLOGIES INC.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Hole Last Boxim
- Publication number 20160343718
- Publication date Nov 24, 2016
- SANDISK TECHNOLOGIES INC.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSED-LOOP CONTROL FOR EFFECTIVE PAD CONDITIONING
- Publication number 20090318060
- Publication date Dec 24, 2009
- Applied Materials, Inc.
- Sivakumar Dhandapani
- B24 - GRINDING POLISHING
Information Patent Application
DETECTION OF CLEARANCE OF POLYSILICON RESIDUE
- Publication number 20080138988
- Publication date Jun 12, 2008
- Jeffrey Drue David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING
- Publication number 20070254485
- Publication date Nov 1, 2007
- Daxin Mao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND COMPOSITION FOR ELECTROCHEMICALLY POLISHING A CONDUCTIVE...
- Publication number 20070102303
- Publication date May 10, 2007
- APPLIED MATERIALS, INC.
- HUYEN KAREN TRAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process and composition for electrochemical mechanical polishing
- Publication number 20060249394
- Publication date Nov 9, 2006
- APPLIED MATERIALS, INC.
- Renhe Jia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tungsten electroprocessing
- Publication number 20060196778
- Publication date Sep 7, 2006
- Renhe Jia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and composition for polishing a substrate
- Publication number 20060169674
- Publication date Aug 3, 2006
- Daxin Mao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for reduced wear polishing pad conditioning
- Publication number 20060046623
- Publication date Mar 2, 2006
- APPLIED MATERIALS, INC.
- Yan Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process and composition for conductive material removal by electroc...
- Publication number 20050218010
- Publication date Oct 6, 2005
- Zhihong Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Endpoint for electrochemical processing
- Publication number 20050077188
- Publication date Apr 14, 2005
- APPLIED MATERIALS, INC.
- Daxin Mao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Three-dimensional memory device containing hydrogen diffusion barri...

Multi-tier memory device with through-stack peripheral contact via...

Through-memory-level via structures between staircase regions in a...

Within-array through-memory-level via structures and method of maki...

Three-dimensional memory device having L-shaped word lines and a su...

Three dimensional memory device containing discrete silicon nitride...

Three-dimensional memory devices containing inter-tier dummy memory...

Bulb-shaped memory stack structures for direct source contact in th...

Method of forming a staircase in a semiconductor device using a lin...

Self-aligned isolation dielectric structures for a three-dimensiona...

Method of making a multilevel memory stack structure using a cavity...

Multi-tier replacement memory stack structure integration scheme

Forming 3D memory cells after word line replacement

Three-dimensional memory devices containing memory block bridges

Three dimensional memory device with peripheral devices under dummy...

Three dimensional memory device with epitaxial semiconductor pedest...

Three dimensional memory device with epitaxial semiconductor pedest...

Closed-loop control for effective pad conditioning

Method and composition for electrochemically polishing a conductive...

Process and composition for conductive material removal by electroc...

Method and apparatus for reduced wear polishing pad conditioning

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HYDROGEN DIFFUSION BARRI...

THREE-DIMENSIONAL MEMORY DEVICES CONTAINING INTER-TIER DUMMY MEMORY...

BULB-SHAPED MEMORY STACK STRUCTURES FOR DIRECT SOURCE CONTACT IN TH...

METHOD OF FORMING A STAIRCASE IN A SEMICONDUCTOR DEVICE USING A LIN...

WITHIN-ARRAY THROUGH-MEMORY-LEVEL VIA STRUCTURES AND METHOD OF MAKI...

THROUGH-MEMORY-LEVEL VIA STRUCTURES BETWEEN STAIRCASE REGIONS IN A...

THREE DIMENSIONAL MEMORY DEVICE CONTAINING DISCRETE SILICON NITRIDE...

MULTI-TIER MEMORY DEVICE WITH THROUGH-STACK PERIPHERAL CONTACT VIA...

SELF-ALIGNED ISOLATION DIELECTRIC STRUCTURES FOR A THREE-DIMENSIONA...

MULTI-TIER REPLACEMENT MEMORY STACK STRUCTURE INTEGRATION SCHEME

METHOD OF MAKING A MULTILEVEL MEMORY STACK STRUCTURE USING A CAVITY...

THREE-DIMENSIONAL MEMORY DEVICES CONTAINING MEMORY BLOCK BRIDGES

Memory Hole Last Boxim

CLOSED-LOOP CONTROL FOR EFFECTIVE PAD CONDITIONING

DETECTION OF CLEARANCE OF POLYSILICON RESIDUE

ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING

METHOD AND COMPOSITION FOR ELECTROCHEMICALLY POLISHING A CONDUCTIVE...

Process and composition for electrochemical mechanical polishing

Tungsten electroprocessing

Method and composition for polishing a substrate

Method and apparatus for reduced wear polishing pad conditioning

Process and composition for conductive material removal by electroc...

Endpoint for electrochemical processing