De-Yuan Lu

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,848,233
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist system and method
- Patent number 11,841,618
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Packages with enlarged through-vias in encapsulant
- Patent number 11,823,969
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with enlarged through-vias in encapsulant
- Patent number 11,515,224
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,289,373
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist system and method
- Patent number 11,215,929
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Transformer and series resonant converter including the same
- Patent number 11,171,561
- Issue date Nov 9, 2021
- National Taiwan University of Science and Technology
- Yu-Chen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 10,861,710
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Series resonant converter
- Patent number 10,778,107
- Issue date Sep 15, 2020
- Yu-Chen Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Serial module of organic solar cell and method for manufacturing th...
- Patent number 9,985,077
- Issue date May 29, 2018
- Atomic Energy Council - Institute of Nuclear Energy Research
- Yu-Ching Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving mass-production yield of large-area organic so...
- Patent number 9,711,722
- Issue date Jul 18, 2017
- Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan,...
- Yu-Ching Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bumps and process for making same
- Patent number 9,449,931
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a solar cell
- Patent number 9,412,959
- Issue date Aug 9, 2016
- Institute of Nuclear Energy Research Atomic Energy Council, Executive Yuan
- Hou-Chin Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number 9,397,080
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing large-area organic solar cells
- Patent number 9,269,904
- Issue date Feb 23, 2016
- Atomic Energy Council - Institute of Nuclear Energy Research
- Yu-Ching Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing constituent layers of polymer solar cells...
- Patent number 9,196,852
- Issue date Nov 24, 2015
- Atomic Energy Council - Institute of Nuclear Energy Research
- Hou-Chin Cha
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Stacked multilayer structure
- Patent number 9,095,084
- Issue date Jul 28, 2015
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a stacked multilayer structure
- Patent number 9,095,085
- Issue date Jul 28, 2015
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number 8,981,559
- Issue date Mar 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of a chip and a substrate
- Patent number 8,941,224
- Issue date Jan 27, 2015
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a chip support board structure
- Patent number 8,887,386
- Issue date Nov 18, 2014
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a laminate circuit board
- Patent number 8,875,390
- Issue date Nov 4, 2014
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pillar bumps and process for making same
- Patent number 8,823,166
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip support board structure
- Patent number 8,766,102
- Issue date Jul 1, 2014
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a heat dissipation structure of a printed...
- Patent number 8,312,624
- Issue date Nov 20, 2012
- Kinsus Interconnect Technology Corp.
- Chien-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adjustable exhaust flow for thermal uniformity
- Patent number 7,026,580
- Issue date Apr 11, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Hwan Kao
- F27 - FURNACES KILNS OVENS RETORTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSFORMER
- Publication number 20250079064
- Publication date Mar 6, 2025
- LITE-ON TECHNOLOGY CORPORATION
- Chen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EXTERNAL CONNECTORS
- Publication number 20240387193
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER
- Publication number 20240186053
- Publication date Jun 6, 2024
- Lite-On Technology Corporation
- Chen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR
- Publication number 20240186060
- Publication date Jun 6, 2024
- Lite-On Technology Corporation
- Chen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC DEVICE AND LLC SERIES RESONANT CONVERTER HAVING THE SAME
- Publication number 20240170204
- Publication date May 23, 2024
- LITE-ON TECHNOLOGY CORPORATION
- Chen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR DEVICE
- Publication number 20240087799
- Publication date Mar 14, 2024
- LITE-ON TECHNOLOGY CORPORATION
- Kai-De CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT
- Publication number 20230369153
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER
- Publication number 20230230748
- Publication date Jul 20, 2023
- LITE-ON TECHNOLOGY CORPORATION
- Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC COMPONENT AND MAGNETIC CORE THEREOF
- Publication number 20230223185
- Publication date Jul 13, 2023
- Lite-On Technology Corporation
- Chen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Enlarged Through-Vias in Encapsulant
- Publication number 20220336307
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co, LTD.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216103
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photoresist System and Method
- Publication number 20220121120
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Packages with Enlarged Through-Vias in Encapsulant
- Publication number 20210225722
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Manufacturing Semiconductor Devices
- Publication number 20210118697
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER AND SERIES RESONANT CONVERTER INCLUDING THE SAME
- Publication number 20200395844
- Publication date Dec 17, 2020
- NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Yu-Chen Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Photoresist System and Method
- Publication number 20200133128
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SERIES RESONANT CONVERTER
- Publication number 20200083817
- Publication date Mar 12, 2020
- Yu-Chen Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200043782
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20200006086
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING MASS-PRODUCTION YIELD OF LARGE-AREA ORGANIC SO...
- Publication number 20170170397
- Publication date Jun 15, 2017
- Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan,...
- YU-CHING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIAL MODULE OF ORGANIC SOLAR CELL AND METHOD FOR MANUFACTURING TH...
- Publication number 20150380465
- Publication date Dec 31, 2015
- ATOMIC ENERGY COUNCIL-INSTITUTE OF NUCLEAR ENERGY RESEARCH
- YU-CHING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Devices and Methods of Packaging Semiconductor Dies
- Publication number 20150187746
- Publication date Jul 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MEMBRANE LAYERS OF ORGANIC SOLAR CELLS BY...
- Publication number 20150056735
- Publication date Feb 26, 2015
- ATOMIC ENERGY COUNCIL-INSTITUTE OF NUCLEAR ENERGY RESEARCH
- HOU-CHIN CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LARGE-AREA ORGANIC SOLAR CELLS
- Publication number 20150004735
- Publication date Jan 1, 2015
- ATOMIC ENERGY COUNCIL-INSTITUTE OF NUCLEAR ENERGY RESEARCH
- YU-CHING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Bumps and Process for Making Same
- Publication number 20140363966
- Publication date Dec 11, 2014
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE OF A CHIP AND A SUBSTRATE
- Publication number 20140291853
- Publication date Oct 2, 2014
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING A CHIP AND A SUBSTRATE
- Publication number 20140295623
- Publication date Oct 2, 2014
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTILAYER STRUCTURE
- Publication number 20140290983
- Publication date Oct 2, 2014
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A STACKED MULTILAYER STRUCTURE
- Publication number 20140290057
- Publication date Oct 2, 2014
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A CHIP SUPPORT BOARD STRUCTURE
- Publication number 20140115888
- Publication date May 1, 2014
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Photoresist system and method

Packages with enlarged through-vias in encapsulant

Packages with enlarged through-vias in encapsulant

Semiconductor package and manufacturing method thereof

Photoresist system and method

Transformer and series resonant converter including the same

Methods of manufacturing semiconductor devices

Series resonant converter

Serial module of organic solar cell and method for manufacturing th...

Method for improving mass-production yield of large-area organic so...

Pillar bumps and process for making same

Method of making a solar cell

Package on package devices and methods of packaging semiconductor dies

Method for manufacturing large-area organic solar cells

Method for manufacturing constituent layers of polymer solar cells...

Stacked multilayer structure

Method of manufacturing a stacked multilayer structure

Package on package devices and methods of packaging semiconductor dies

Package structure of a chip and a substrate

Method of manufacturing a chip support board structure

Method of manufacturing a laminate circuit board

Pillar bumps and process for making same

Chip support board structure

Method for manufacturing a heat dissipation structure of a printed...

Adjustable exhaust flow for thermal uniformity

Patents Applicationslast 30 patents

TRANSFORMER

SEMICONDUCTOR DEVICES WITH EXTERNAL CONNECTORS

TRANSFORMER

INDUCTOR

MAGNETIC DEVICE AND LLC SERIES RESONANT CONVERTER HAVING THE SAME

INDUCTOR DEVICE

PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT

TRANSFORMER

MAGNETIC COMPONENT AND MAGNETIC CORE THEREOF

Packages with Enlarged Through-Vias in Encapsulant

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Photoresist System and Method

Packages with Enlarged Through-Vias in Encapsulant

Methods of Manufacturing Semiconductor Devices

TRANSFORMER AND SERIES RESONANT CONVERTER INCLUDING THE SAME

Photoresist System and Method

SERIES RESONANT CONVERTER

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Manufacture

METHOD FOR IMPROVING MASS-PRODUCTION YIELD OF LARGE-AREA ORGANIC SO...

SERIAL MODULE OF ORGANIC SOLAR CELL AND METHOD FOR MANUFACTURING TH...

Package on Package Devices and Methods of Packaging Semiconductor Dies

METHOD FOR MANUFACTURING MEMBRANE LAYERS OF ORGANIC SOLAR CELLS BY...

METHOD FOR MANUFACTURING LARGE-AREA ORGANIC SOLAR CELLS

Pillar Bumps and Process for Making Same

PACKAGE STRUCTURE OF A CHIP AND A SUBSTRATE

METHOD OF PACKAGING A CHIP AND A SUBSTRATE

STACKED MULTILAYER STRUCTURE

METHOD OF MANUFACTURING A STACKED MULTILAYER STRUCTURE

METHOD OF MANUFACTURING A CHIP SUPPORT BOARD STRUCTURE