Dean J. Denning

Person

Del Valle, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a die with recessed aluminum die pads
- Patent number 9,209,078
- Issue date Dec 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a die with recessed aluminum die pads
- Patent number 8,722,530
- Issue date May 13, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming a layer on a substrate
- Patent number 6,500,315
- Issue date Dec 31, 2002
- Motorola, Inc.
- Valli Arunachalam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Percent backsputtering as a control parameter for metallization
- Patent number 6,476,623
- Issue date Nov 5, 2002
- Motorola, Inc.
- Scott C. Bolton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a semiconductor device barrier layer
- Patent number 6,451,181
- Issue date Sep 17, 2002
- Motorola, Inc.
- Dean J. Denning
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device adhesive layer structure and process for formi...
- Patent number 6,294,458
- Issue date Sep 25, 2001
- Motorola, Inc.
- Jiming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 6,218,302
- Issue date Apr 17, 2001
- Motorola Inc.
- Gregor Braeckelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inert plasma gas surface cleaning process performed insitu with phy...
- Patent number 6,187,682
- Issue date Feb 13, 2001
- Motorola Inc.
- Dean J. Denning
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for forming a layer on a substrate
- Patent number 6,139,696
- Issue date Oct 31, 2000
- Motorola, Inc.
- Valli Arunachalam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a conductive structure having a composite or amo...
- Patent number 6,136,682
- Issue date Oct 24, 2000
- Motorola Inc.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a semiconductor device
- Patent number 5,958,508
- Issue date Sep 28, 1999
- Motorlola, Inc.
- Olubunmi Olufemi Adetutu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for forming a semiconductor device
- Patent number 5,893,752
- Issue date Apr 13, 1999
- Motorola, Inc.
- Jiming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a semiconductor device and a static-random-acce...
- Patent number 5,721,167
- Issue date Feb 24, 1998
- Motorola, Inc.
- Chitra Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature controlled process for the epitaxial growth of a film o...
- Patent number 5,308,788
- Issue date May 3, 1994
- Motorola, Inc.
- Jon T. Fitch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING A DIE WITH RECESSED ALUMINUM DIE PADS
- Publication number 20140213050
- Publication date Jul 31, 2014
- FREESCALE SEMICONDUCTOR, INC.
- GREGORY S. SPENCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A DIE WITH RECESSED ALUMIUM DIE PADS
- Publication number 20130029485
- Publication date Jan 31, 2013
- Gregory S. Spencer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING A PHOTODETECTOR
- Publication number 20110027950
- Publication date Feb 3, 2011
- Robert E. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for plasma deposition of a substrate barrier layer
- Publication number 20040211661
- Publication date Oct 28, 2004
- Da Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for depositing barrier layers in an opening
- Publication number 20030203615
- Publication date Oct 30, 2003
- Dean J. Denning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making an inlaid structure in a semiconductor device
- Publication number 20030134504
- Publication date Jul 17, 2003
- Dean J. Denning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a barrier layer for use in a copper interconnect
- Publication number 20020092763
- Publication date Jul 18, 2002
- Dean J. Denning
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Dean J. Denning

Person

Patents Grantslast 30 patents

Method of making a die with recessed aluminum die pads

Method of making a die with recessed aluminum die pads

Method and apparatus for forming a layer on a substrate

Percent backsputtering as a control parameter for metallization

Method of forming a semiconductor device barrier layer

Semiconductor device adhesive layer structure and process for formi...

Method for forming a semiconductor device

Inert plasma gas surface cleaning process performed insitu with phy...

Method and apparatus for forming a layer on a substrate

Method for forming a conductive structure having a composite or amo...

Process for forming a semiconductor device

Process for forming a semiconductor device

Process for forming a semiconductor device and a static-random-acce...

Temperature controlled process for the epitaxial growth of a film o...

Patents Applicationslast 30 patents

METHOD OF MAKING A DIE WITH RECESSED ALUMINUM DIE PADS

METHOD OF MAKING A DIE WITH RECESSED ALUMIUM DIE PADS

METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING A PHOTODETECTOR

Method for plasma deposition of a substrate barrier layer

Method for depositing barrier layers in an opening

Method of making an inlaid structure in a semiconductor device

Method for forming a barrier layer for use in a copper interconnect