Dean L. Frew

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Garland, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Solder bump transfer for microelectronics packaging and assembly
- Patent number 5,646,068
- Issue date Jul 8, 1997
- Texas Instruments Incorporated
- Arthur M. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional assembly of integrated circuit chips
- Patent number 5,327,327
- Issue date Jul 5, 1994
- Texas Instruments Incorporated
- Dean L. Frew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive burn-in test socket for integrated circuit die
- Patent number 5,123,850
- Issue date Jun 23, 1992
- Texas Instruments Incorporated
- Richard A. Elder
- G01 - MEASURING TESTING