Dean Lee Monthei

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Beaverton, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for reduced delamination of an integrated circ...
- Patent number 8,274,162
- Issue date Sep 25, 2012
- TriQuint Semiconductor, Inc.
- Dean L. Monthei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless package
- Patent number 8,030,770
- Issue date Oct 4, 2011
- TriQuint Semiconductor, Inc.
- Frank Juskey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and method for reduced delamination of an integrated circ...
- Publication number 20080174003
- Publication date Jul 24, 2008
- Dean L. Monthei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package including an electromagnetic shield
- Publication number 20070163802
- Publication date Jul 19, 2007
- TriQuint Semiconductors, Inc.
- Dean L. Monthei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Separating die on a substrate to reduce backside chipping
- Publication number 20060057777
- Publication date Mar 16, 2006
- William Christopher Howell
- H01 - BASIC ELECTRIC ELEMENTS