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Tainan, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Packages with stacked dies and methods of forming the same
Patent number
9,984,999
Issue date
May 29, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hsun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
POP structures with dams encircling air gaps and methods for formin...
Patent number
9,659,918
Issue date
May 23, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through silicon via bonding structure
Patent number
8,932,906
Issue date
Jan 13, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Dean Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for stacking devices
Patent number
8,334,170
Issue date
Dec 18, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Dean Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding metallurgy for three-dimensional interconnect
Patent number
8,242,611
Issue date
Aug 14, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Bo-I Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and fabrication methods thereof
Patent number
7,888,236
Issue date
Feb 15, 2011
Taiwan Semiconductor Manufacturing Co., Ltd.
Han-Ping Pu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding metallurgy for three-dimensional interconnect
Patent number
7,851,346
Issue date
Dec 14, 2010
Taiwan Semiconductor Manufacturing Company, Ltd.
Bo-I Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Packages with Stacked Dies and Methods of Forming the Same
Publication number
20160247786
Publication date
Aug 25, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hsun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POP Structures with Dams Encircling Air Gaps and Methods for Formin...
Publication number
20160163683
Publication date
Jun 9, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Through Silicon Via Bonding Structure
Publication number
20150137328
Publication date
May 21, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Dean Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Stacking Devices and Structure Thereof
Publication number
20130127049
Publication date
May 23, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Dean Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding Metallurgy for Three-Dimensional Interconnect
Publication number
20110058346
Publication date
Mar 10, 2011
Taiwan Semiconductor Manufacturing Company, Ltd.
Bo-I Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Through Silicon Via Bonding Structure
Publication number
20100047963
Publication date
Feb 25, 2010
Dean Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding Metallurgy for Three-Dimensional Interconnect
Publication number
20100015792
Publication date
Jan 21, 2010
Bo-I Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR STACKING DEVICES
Publication number
20090321948
Publication date
Dec 31, 2009
Taiwan Semiconductor Manufacturing Company, Ltd.
Dean Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and fabrication methods thereof
Publication number
20080286938
Publication date
Nov 20, 2008
Taiwan Semiconductor Manufacturing Co., Ltd.
Han-Ping Pu
H01 - BASIC ELECTRIC ELEMENTS