Deanna M. Dowdle

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Bloomer, WI, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing interconnect bumps
- Patent number 5,283,948
- Issue date Feb 8, 1994
- Cray Research, Inc.
- Paul E. Schroeder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible automated bonding method and apparatus
- Patent number 5,127,570
- Issue date Jul 7, 1992
- Cray Research, Inc.
- Richard R. Steitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preparation of photoconductive film using radiation curable resin
- Patent number 4,383,020
- Issue date May 10, 1983
- Sheldahl, Inc.
- Sidney J. Roberts
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY