Deborah Derfelt Forray

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mold compositions with high adhesion to metal substrates
- Patent number 7,863,346
- Issue date Jan 4, 2011
- Designer Molecules, Inc.
- Stephen M. Dershem
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
B-stageable die attach adhesives
- Patent number 7,851,254
- Issue date Dec 14, 2010
- Henkel Corporation
- Deborah Derfelt Forray
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Underfill compositions and methods for use thereof
- Patent number 7,786,248
- Issue date Aug 31, 2010
- Designer Molecules, Inc.
- Stephen M. Dershem
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Methods for assembling thin semiconductor die
- Patent number 7,645,637
- Issue date Jan 12, 2010
- Henkel Corporation
- Deborah Forray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
B-stageable die attach adhesives
- Patent number 7,176,044
- Issue date Feb 13, 2007
- Henkel Corporation
- Deborah Derfelt Forray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perfluorinated hydrocarbon polymer-filled adhesive formulations and...
- Patent number 5,717,034
- Issue date Feb 10, 1998
- Quantum Materials, Inc.
- Stephen M. Dershem
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
THERMAL INTERFACE MATERIAL WITH PHENYL ESTER
- Publication number 20120279697
- Publication date Nov 8, 2012
- Deborah Forray
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS FOR ASSEMBLING THIN SEMICONDUCTOR DIE
- Publication number 20090275171
- Publication date Nov 5, 2009
- Deborah Forray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
B-STAGEABLE DIE ATTACH ADHESIVES
- Publication number 20080160315
- Publication date Jul 3, 2008
- Henkel Corporation
- Deborah Derfelt Forray
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Mold compositions with high adhesion to metal substrates
- Publication number 20070299154
- Publication date Dec 27, 2007
- Stephen M. Dershem
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor die assembly
- Publication number 20070176276
- Publication date Aug 2, 2007
- Debbie Forray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill compositions and methods for use thereof
- Publication number 20060069232
- Publication date Mar 30, 2006
- Stephen M. Dershem
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyalkylsilsesquioxane-filled adhesive compositions and methods fo...
- Publication number 20060063014
- Publication date Mar 23, 2006
- Debbie Forray
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Highly conductive resin compositions
- Publication number 20040225045
- Publication date Nov 11, 2004
- HENKEL LOCTITE CORPORATION
- Deborah Derfelt Forray
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
B-stageable die attach adhesives
- Publication number 20040102566
- Publication date May 27, 2004
- HENKEL LOCTITE CORPORATION
- Deborah Derfelt Forray
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS FOR REDUCING VOID FORMATION UPON CURING OF ADHESIVE FORMULA...
- Publication number 20020062923
- Publication date May 30, 2002
- DEBORAH D. FORRAY
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Deborah Derfelt Forray

Person

Patents Grantslast 30 patents

Mold compositions with high adhesion to metal substrates

B-stageable die attach adhesives

Underfill compositions and methods for use thereof

Methods for assembling thin semiconductor die

B-stageable die attach adhesives

Perfluorinated hydrocarbon polymer-filled adhesive formulations and...

Patents Applicationslast 30 patents

THERMAL INTERFACE MATERIAL WITH PHENYL ESTER

METHODS FOR ASSEMBLING THIN SEMICONDUCTOR DIE

B-STAGEABLE DIE ATTACH ADHESIVES

Mold compositions with high adhesion to metal substrates

Semiconductor die assembly

Underfill compositions and methods for use thereof

Polyalkylsilsesquioxane-filled adhesive compositions and methods fo...

Highly conductive resin compositions

B-stageable die attach adhesives

METHODS FOR REDUCING VOID FORMATION UPON CURING OF ADHESIVE FORMULA...