Deep C. Dumka

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip suitable for 2.5D and 3D packaging integration a...
- Patent number 11,948,838
- Issue date Apr 2, 2024
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with embedded heat spreader in a re...
- Patent number 11,626,340
- Issue date Apr 11, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip suitable for 2.5D and 3D packaging integration a...
- Patent number 11,610,814
- Issue date Mar 21, 2023
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip suitable for 2.5D and 3D packaging integration a...
- Patent number 11,289,377
- Issue date Mar 29, 2022
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip suitable for 2.5D and 3D packaging integration a...
- Patent number 11,145,547
- Issue date Oct 12, 2021
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module assembly
- Patent number 11,127,665
- Issue date Sep 21, 2021
- Qorvo US, Inc.
- Deep C. Dumka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module assembly
- Patent number 10,403,568
- Issue date Sep 3, 2019
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for high-power semiconductor devices
- Patent number 9,559,034
- Issue date Jan 31, 2017
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride on high thermal conductivity material device and me...
- Patent number 9,337,278
- Issue date May 10, 2016
- TriQuint Semiconductor, Inc.
- Xing Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for high-power semiconductor devices
- Patent number 8,946,894
- Issue date Feb 3, 2015
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor having a plurality of field plates
- Patent number 8,754,496
- Issue date Jun 17, 2014
- TriQuint Semiconductor, Inc.
- Hua-Quen Tserng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device structure including high-thermal-conductivity substrate
- Patent number 8,350,295
- Issue date Jan 8, 2013
- TriQuint Semiconductor, Inc.
- Paul Saunier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20230207415
- Publication date Jun 29, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION A...
- Publication number 20230197517
- Publication date Jun 22, 2023
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METALLIZATION FOR SEMICONDUCTOR ASSEMBLY
- Publication number 20230178486
- Publication date Jun 8, 2023
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION A...
- Publication number 20220028741
- Publication date Jan 27, 2022
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20210183722
- Publication date Jun 17, 2021
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION A...
- Publication number 20210098296
- Publication date Apr 1, 2021
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION A...
- Publication number 20210098340
- Publication date Apr 1, 2021
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE ASSEMBLY
- Publication number 20190341343
- Publication date Nov 7, 2019
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE ASSEMBLY
- Publication number 20180122735
- Publication date May 3, 2018
- Qorvo US, Inc.
- Deep C. Dumka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES
- Publication number 20160155681
- Publication date Jun 2, 2016
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES
- Publication number 20150104906
- Publication date Apr 16, 2015
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES
- Publication number 20140231815
- Publication date Aug 21, 2014
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR HAVING A PLURALITY OF FIELD PLATES
- Publication number 20100259321
- Publication date Oct 14, 2010
- TriQuint Semiconductor, Inc.
- Hua-Quen Tserng
- H01 - BASIC ELECTRIC ELEMENTS

Deep C. Dumka

Person

Patents Grantslast 30 patents

Semiconductor chip suitable for 2.5D and 3D packaging integration a...

Method for packaging an integrated circuit (IC) package with embedd...

Integrated circuit (IC) package with embedded heat spreader in a re...

Semiconductor chip suitable for 2.5D and 3D packaging integration a...

Semiconductor chip suitable for 2.5D and 3D packaging integration a...

Semiconductor chip suitable for 2.5D and 3D packaging integration a...

Module assembly

Module assembly

Package for high-power semiconductor devices

Gallium nitride on high thermal conductivity material device and me...

Package for high-power semiconductor devices

Field effect transistor having a plurality of field plates

Device structure including high-thermal-conductivity substrate

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION A...

BACKSIDE METALLIZATION FOR SEMICONDUCTOR ASSEMBLY

SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION A...

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION A...

SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION A...

MODULE ASSEMBLY

MODULE ASSEMBLY

PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES

PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES

PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES

FIELD EFFECT TRANSISTOR HAVING A PLURALITY OF FIELD PLATES