Deepak Goyal

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally conductive slugs/active dies to improve cooling of stacke...
- Patent number 12,094,800
- Issue date Sep 17, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader (IHS) with heating element
- Patent number 11,798,861
- Issue date Oct 24, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies including a thermal interface material
- Patent number 11,791,237
- Issue date Oct 17, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for failure analysis using RF-based thermometry
- Patent number 11,551,956
- Issue date Jan 10, 2023
- Intel Corporation
- Chandrashekara Shashank Kaira
- G01 - MEASURING TESTING
Information Patent Grant
X-ray filter
- Patent number 11,506,709
- Issue date Nov 22, 2022
- Intel Corporation
- Mario Pacheco
- G01 - MEASURING TESTING
Information Patent Grant
Method of sample preparation using dual ion beam trenching
- Patent number 11,476,120
- Issue date Oct 18, 2022
- Intel Corporation
- Purushotham Kaushik Muthur Srinath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, device and system for non-destructive detection of defects...
- Patent number 11,346,818
- Issue date May 31, 2022
- Intel Corporation
- Mario Pacheco
- G01 - MEASURING TESTING
Information Patent Grant
Integrated cable probe design for high bandwidth RF testing
- Patent number 11,226,353
- Issue date Jan 18, 2022
- Intel Corporation
- Chengqing Hu
- G01 - MEASURING TESTING
Information Patent Grant
Method of resonance analysis for electrical fault isolation
- Patent number 10,935,593
- Issue date Mar 2, 2021
- Intel Corporation
- Deepak Goyal
- G01 - MEASURING TESTING
Information Patent Grant
Characterization of transmission media
- Patent number 10,908,206
- Issue date Feb 2, 2021
- Intel Corporation
- Mayue Xie
- G01 - MEASURING TESTING
Information Patent Grant
High power terahertz impulse for fault isolation
- Patent number 10,746,780
- Issue date Aug 18, 2020
- Intel Corporation
- Mayue Xie
- G01 - MEASURING TESTING
Information Patent Grant
Electronic assembly using bismuth-rich solder
- Patent number 10,361,167
- Issue date Jul 23, 2019
- Intel Corporation
- Pilin Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-destructive 3-dimensional chemical imaging of photo-resist mate...
- Patent number 10,078,204
- Issue date Sep 18, 2018
- Intel Corporation
- Nilanjan Z. Ghosh
- G02 - OPTICS
Information Patent Grant
Terahertz transmission contactless probing and scanning for signal...
- Patent number 9,817,028
- Issue date Nov 14, 2017
- Intel Corporation
- Mayue Xie
- G01 - MEASURING TESTING
Information Patent Grant
Inline inspection of the contact between conductive traces and subs...
- Patent number 9,746,428
- Issue date Aug 29, 2017
- Intel Corporation
- Shuhong Liu
- G02 - OPTICS
Information Patent Grant
Device, system and method for alignment of an integrated circuit as...
- Patent number 9,625,256
- Issue date Apr 18, 2017
- Intel Corporation
- Purushotham Kaushik Muthur Srinath
- G01 - MEASURING TESTING
Information Patent Grant
Inline measurement of molding material thickness using terahertz re...
- Patent number 9,508,610
- Issue date Nov 29, 2016
- Intel Corporation
- Shuhong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inline inspection of the contact between conductive traces and subs...
- Patent number 9,389,064
- Issue date Jul 12, 2016
- Intel Corporation
- Shuhong Liu
- G01 - MEASURING TESTING
Information Patent Grant
Detection of defect in die
- Patent number 9,291,576
- Issue date Mar 22, 2016
- Intel Corporation
- Mario Pacheco
- G01 - MEASURING TESTING
Information Patent Grant
Electro-optic time domain reflectometry
- Patent number 7,280,190
- Issue date Oct 9, 2007
- Intel Corporation
- Zhiyong Wang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
TEC-EMBEDDED DUMMY DIE TO COOL THE BOTTOM DIE EDGE HOTSPOT
- Publication number 20220199482
- Publication date Jun 23, 2022
- Intel Corporation
- Chia-Pin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR FAILURE ANALYSIS USING RF-BASED THERMOMETRY
- Publication number 20210407833
- Publication date Dec 30, 2021
- Intel Corporation
- Chandrashekara Shashank Kaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, DEVICE AND SYSTEM FOR NON-DESTRUCTIVE DETECTION OF DEFECTS...
- Publication number 20210364474
- Publication date Nov 25, 2021
- Intel Corporation
- Mario Pacheco
- G01 - MEASURING TESTING
Information Patent Application
THERMALLY CONDUCTIVE SLUGS/ACTIVE DIES TO IMPROVE COOLING OF STACKE...
- Publication number 20210193552
- Publication date Jun 24, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CABLE PROBE DESIGN FOR HIGH BANDWIDTH RF TESTING
- Publication number 20210132113
- Publication date May 6, 2021
- Intel Corporation
- Chengqing Hu
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT
- Publication number 20210013117
- Publication date Jan 14, 2021
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
X-RAY FILTER
- Publication number 20200166569
- Publication date May 28, 2020
- Intel Corporation
- Mario Pacheco
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF SAMPLE PREPARATION USING DUAL ION BEAM TRENCHING
- Publication number 20200098554
- Publication date Mar 26, 2020
- Intel Corporation
- Purushotham Kaushik MUTHUR SRINATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A THERMAL INTERFACE MATERIAL
- Publication number 20200006192
- Publication date Jan 2, 2020
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARACTERIZATION OF TRANSMISSION MEDIA
- Publication number 20190293708
- Publication date Sep 26, 2019
- Intel Corporation
- Mayue Xie
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF RESONANCE ANALYSIS FOR ELECTRICAL FAULT ISOLATION
- Publication number 20190204376
- Publication date Jul 4, 2019
- Deepak Goyal
- G01 - MEASURING TESTING
Information Patent Application
HIGH POWER TERAHERTZ IMPULSE FOR FAULT ISOLATION
- Publication number 20180335465
- Publication date Nov 22, 2018
- Intel Corporation
- Mayue Xie
- G01 - MEASURING TESTING
Information Patent Application
WAVELENGTH MODULATABLE INTERFEROMETER
- Publication number 20180283845
- Publication date Oct 4, 2018
- Intel Corporation
- Mario Pacheco
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC ASSEMBLY USING BISMUTH-RICH SOLDER
- Publication number 20180254256
- Publication date Sep 6, 2018
- Pilin Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETECTING VOIDS AND DELAMINATION IN PHOTORESIST LAYER
- Publication number 20170284943
- Publication date Oct 5, 2017
- Nilanjan Ghosh
- G01 - MEASURING TESTING
Information Patent Application
MEASURING SURFACE LAYER THICKNESS
- Publication number 20170176173
- Publication date Jun 22, 2017
- Intel Corporation
- Yanmei Song
- G01 - MEASURING TESTING
Information Patent Application
MATERIAL THICKNESS DEVICE AND METHOD
- Publication number 20170170080
- Publication date Jun 15, 2017
- Intel Corporation
- Darko Grujicic
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TERAHERTZ TRANSMISSION CONTACTLESS PROBING AND SCANNING FOR SIGNAL...
- Publication number 20170089951
- Publication date Mar 30, 2017
- Mayue Xie
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT DEVICE INSPECTION SYSTEMS USING TEMPERATURE GRADIENTS
- Publication number 20160274044
- Publication date Sep 22, 2016
- Intel Corporation
- Mayue Xie
- G01 - MEASURING TESTING
Information Patent Application
INLINE INSPECTION OF THE CONTACT BETWEEN CONDUCTIVE TRACES AND SUBS...
- Publication number 20160245758
- Publication date Aug 25, 2016
- Intel Corporation
- Shuhong Liu
- G01 - MEASURING TESTING
Information Patent Application
INLINE MEASUREMENT OF MOLDING MATERIAL THICKNESS USING TERAHERTZ RE...
- Publication number 20160093540
- Publication date Mar 31, 2016
- Intel Corporation
- Shuhong LIU
- G01 - MEASURING TESTING
Information Patent Application
DETECTION OF DEFECT IN DIE
- Publication number 20160011122
- Publication date Jan 14, 2016
- Intel Corporation
- Mario Pacheco
- G01 - MEASURING TESTING
Information Patent Application
INLINE INSPECTION OF THE CONTACT BETWEEN CONDUCTIVE TRACES AND SUBS...
- Publication number 20150276375
- Publication date Oct 1, 2015
- Shuhong Liu
- G01 - MEASURING TESTING
Information Patent Application
Non-Destructive 3-Dimensional Chemical Imaging Of Photo-Resist Mate...
- Publication number 20150276480
- Publication date Oct 1, 2015
- Nilanjan GHOSH
- G01 - MEASURING TESTING
Information Patent Application
SOLDER ALLOY TO ENHANCE RELIABILITY OF SOLDER INTERCONNECTS WITH NI...
- Publication number 20150255414
- Publication date Sep 10, 2015
- Pilin Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Deepak Goyal

Person

Patents Grantslast 30 patents

Thermally conductive slugs/active dies to improve cooling of stacke...

Integrated heat spreader (IHS) with heating element

Microelectronic assemblies including a thermal interface material

Method and device for failure analysis using RF-based thermometry

X-ray filter

Method of sample preparation using dual ion beam trenching

Method, device and system for non-destructive detection of defects...

Integrated cable probe design for high bandwidth RF testing

Method of resonance analysis for electrical fault isolation

Characterization of transmission media

High power terahertz impulse for fault isolation

Electronic assembly using bismuth-rich solder

Non-destructive 3-dimensional chemical imaging of photo-resist mate...

Terahertz transmission contactless probing and scanning for signal...

Inline inspection of the contact between conductive traces and subs...

Device, system and method for alignment of an integrated circuit as...

Inline measurement of molding material thickness using terahertz re...

Inline inspection of the contact between conductive traces and subs...

Detection of defect in die

Electro-optic time domain reflectometry

Patents Applicationslast 30 patents

TEC-EMBEDDED DUMMY DIE TO COOL THE BOTTOM DIE EDGE HOTSPOT

METHOD AND DEVICE FOR FAILURE ANALYSIS USING RF-BASED THERMOMETRY

METHOD, DEVICE AND SYSTEM FOR NON-DESTRUCTIVE DETECTION OF DEFECTS...

THERMALLY CONDUCTIVE SLUGS/ACTIVE DIES TO IMPROVE COOLING OF STACKE...

INTEGRATED CABLE PROBE DESIGN FOR HIGH BANDWIDTH RF TESTING

INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT

X-RAY FILTER

METHOD OF SAMPLE PREPARATION USING DUAL ION BEAM TRENCHING

MICROELECTRONIC ASSEMBLIES INCLUDING A THERMAL INTERFACE MATERIAL

CHARACTERIZATION OF TRANSMISSION MEDIA

METHOD OF RESONANCE ANALYSIS FOR ELECTRICAL FAULT ISOLATION

HIGH POWER TERAHERTZ IMPULSE FOR FAULT ISOLATION

WAVELENGTH MODULATABLE INTERFEROMETER

ELECTRONIC ASSEMBLY USING BISMUTH-RICH SOLDER

DETECTING VOIDS AND DELAMINATION IN PHOTORESIST LAYER

MEASURING SURFACE LAYER THICKNESS

MATERIAL THICKNESS DEVICE AND METHOD

TERAHERTZ TRANSMISSION CONTACTLESS PROBING AND SCANNING FOR SIGNAL...

CIRCUIT DEVICE INSPECTION SYSTEMS USING TEMPERATURE GRADIENTS

INLINE INSPECTION OF THE CONTACT BETWEEN CONDUCTIVE TRACES AND SUBS...

INLINE MEASUREMENT OF MOLDING MATERIAL THICKNESS USING TERAHERTZ RE...

DETECTION OF DEFECT IN DIE

INLINE INSPECTION OF THE CONTACT BETWEEN CONDUCTIVE TRACES AND SUBS...

Non-Destructive 3-Dimensional Chemical Imaging Of Photo-Resist Mate...

SOLDER ALLOY TO ENHANCE RELIABILITY OF SOLDER INTERCONNECTS WITH NI...