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Deepak Nayak
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Los Angeles, CA, US
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last 30 patents
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Patent Grant
High performance integrated circuit chip package
Patent number
5,325,265
Issue date
Jun 28, 1994
MCNC
Iwona Turlik
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Metal-to-metal bonding method and resulting structure
Patent number
5,009,360
Issue date
Apr 23, 1991
MCNC
Arnold Reisman
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR