Deepak Thimmegowda

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Block-to-block isolation and deep contact using pillars in a memory...
- Patent number 12,120,878
- Issue date Oct 15, 2024
- Intel Corporation
- Deepak Thimmegowda
- G11 - INFORMATION STORAGE
Information Patent Grant
Asymmetric junctions of high voltage transistor in NAND flash memory
- Patent number 11,653,496
- Issue date May 16, 2023
- Intel Corporation
- Chang Wan Ha
- G11 - INFORMATION STORAGE
Information Patent Grant
Transistors, semiconductor constructions, and methods of forming se...
- Patent number 11,424,256
- Issue date Aug 23, 2022
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array having connections going through control gates
- Patent number 11,398,489
- Issue date Jul 26, 2022
- Micron Technology, Inc.
- Toru Tanzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including stair step structures, and related apparatuses an...
- Patent number 11,393,716
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with vertical string drivers
- Patent number 10,804,280
- Issue date Oct 13, 2020
- Intel Corporation
- Khaled Hasnat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array having connections going through control gates
- Patent number 10,770,470
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Toru Tanzawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory devices and related methods
- Patent number 10,748,811
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional storage cell array with highly dense and scalable...
- Patent number 10,593,624
- Issue date Mar 17, 2020
- Intel Corporation
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wordline bridge in a 3D memory array
- Patent number 10,515,973
- Issue date Dec 24, 2019
- Intel Corporation
- Deepak Thimmegowda
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor constructions which include metal-containing gate por...
- Patent number 10,497,707
- Issue date Dec 3, 2019
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stair step formation using at least two masks
- Patent number 10,269,626
- Issue date Apr 23, 2019
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional storage cell array with highly dense and scalable...
- Patent number 10,043,751
- Issue date Aug 7, 2018
- Intel Corporation
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stair step formation using at least two masks
- Patent number 9,870,941
- Issue date Jan 16, 2018
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Performing read operations on a memory device
- Patent number 9,865,357
- Issue date Jan 9, 2018
- Intel Corporation
- Deepak Thimmegowda
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming semiconductor constructions
- Patent number 9,613,978
- Issue date Apr 4, 2017
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array having connections going through control gates
- Patent number 9,595,533
- Issue date Mar 14, 2017
- Micron Technology, Inc.
- Toru Tanzawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatuses and methods for die seal crack detection
- Patent number 9,557,376
- Issue date Jan 31, 2017
- Micron Technology, Inc.
- Charles H. Dennison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stair step formation using at least two masks
- Patent number 9,508,591
- Issue date Nov 29, 2016
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for die seal crack detection
- Patent number 9,287,184
- Issue date Mar 15, 2016
- Micron Technology, Inc.
- Charles H. Dennison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-D memory arrays
- Patent number 9,219,070
- Issue date Dec 22, 2015
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors, semiconductor constructions, and methods of forming se...
- Patent number 9,219,132
- Issue date Dec 22, 2015
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stair step formation using at least two masks
- Patent number 9,082,772
- Issue date Jul 14, 2015
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors and semiconductor constructions
- Patent number 8,853,769
- Issue date Oct 7, 2014
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stair step formation using at least two masks
- Patent number 8,609,536
- Issue date Dec 17, 2013
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PARALLEL STAIRCASE 3D NAND
- Publication number 20230200063
- Publication date Jun 22, 2023
- Intel Corporation
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND WITH IO CONTACTS IN ISOLATION TRENCH
- Publication number 20230076831
- Publication date Mar 9, 2023
- Intel Corporation
- Praveen Kumar Kalsani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCK-TO-BLOCK ISOLATION AND DEEP CONTACT USING PILLARS IN A MEMORY...
- Publication number 20230036595
- Publication date Feb 2, 2023
- Intel Corporation
- Deepak THIMMEGOWDA
- G11 - INFORMATION STORAGE
Information Patent Application
SPLIT BLOCK ARRAY FOR 3D NAND MEMORY
- Publication number 20220399057
- Publication date Dec 15, 2022
- Intel Corporation
- Chang Wan Ha
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY ARRAY HAVING CONNECTIONS GOING THROUGH CONTROL GATES
- Publication number 20220359554
- Publication date Nov 10, 2022
- Micron Technology, Inc.
- Toru Tanzawa
- G11 - INFORMATION STORAGE
Information Patent Application
ASYMMETRIC JUNCTIONS OF HIGH VOLTAGE TRANSISTOR IN NAND FLASH MEMORY
- Publication number 20220102365
- Publication date Mar 31, 2022
- Intel Corporation
- Chang Wan HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAY HAVING CONNECTIONS GOING THROUGH CONTROL GATES
- Publication number 20210005624
- Publication date Jan 7, 2021
- Micron Technology, Inc.
- Toru Tanzawa
- G11 - INFORMATION STORAGE
Information Patent Application
DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED APPARATUSES AN...
- Publication number 20200365452
- Publication date Nov 19, 2020
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL STRING DRIVER WITH EXTENDED GATE JUNCTION STRUCTURE
- Publication number 20200227429
- Publication date Jul 16, 2020
- Intel Corporation
- Dong JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL STRING DRIVER WITH CHANNEL FIELD MANAGEMENT STRUCTURE
- Publication number 20200227525
- Publication date Jul 16, 2020
- Intel Corporation
- Dong JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH A SPLIT STAIRCASE
- Publication number 20200152650
- Publication date May 14, 2020
- Intel Corporation
- Deepak Thimmegowda
- G11 - INFORMATION STORAGE
Information Patent Application
Transistors, Semiconductor Constructions, and Methods of Forming Se...
- Publication number 20200058662
- Publication date Feb 20, 2020
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND RELATED METHODS
- Publication number 20190237362
- Publication date Aug 1, 2019
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH VERTICAL STRING DRIVERS
- Publication number 20190043873
- Publication date Feb 7, 2019
- Intel Corporation
- Khaled Hasnat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORDLINE BRIDGE IN A 3D MEMORY ARRAY
- Publication number 20190043874
- Publication date Feb 7, 2019
- Intel Corporation
- Deepak Thimmegowda
- G11 - INFORMATION STORAGE
Information Patent Application
THREE DIMENSIONAL STORAGE CELL ARRAY WITH HIGHLY DENSE AND SCALABLE...
- Publication number 20180331034
- Publication date Nov 15, 2018
- Intel Corporation
- Deepak THIMMEGOWDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIR STEP FORMATION USING AT LEAST TWO MASKS
- Publication number 20180130700
- Publication date May 10, 2018
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL STORAGE CELL ARRAY WITH HIGHLY DENSE AND SCALABLE...
- Publication number 20170287833
- Publication date Oct 5, 2017
- Intel Corporation
- Deepak THIMMEGOWDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAY HAVING CONNECTIONS GOING THROUGH CONTROL GATES
- Publication number 20170250190
- Publication date Aug 31, 2017
- Micron Technology, Inc.
- Toru Tanzawa
- G11 - INFORMATION STORAGE
Information Patent Application
Transistors, Semiconductor Constructions, and Methods of Forming Se...
- Publication number 20170162589
- Publication date Jun 8, 2017
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIR STEP FORMATION USING AT LEAST TWO MASKS
- Publication number 20170076977
- Publication date Mar 16, 2017
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR DIE SEAL CRACK DETECTION
- Publication number 20160195581
- Publication date Jul 7, 2016
- Micron Technology, Inc.
- Charles H. Dennison
- G01 - MEASURING TESTING
Information Patent Application
Transistors, Semiconductor Constructions, and Methods of Forming Se...
- Publication number 20160079274
- Publication date Mar 17, 2016
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ARRAY ROUTING FOR NON-VOLATILE MEMORY
- Publication number 20150371925
- Publication date Dec 24, 2015
- Intel Corporation
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIR STEP FORMATION USING AT LEAST TWO MASKS
- Publication number 20150318203
- Publication date Nov 5, 2015
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR DIE SEAL CRACK DETECTION
- Publication number 20150170979
- Publication date Jun 18, 2015
- Micron Technology, Inc.
- Charles H. Dennison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistors, Semiconductor Constructions, and Methods of Forming Se...
- Publication number 20150044834
- Publication date Feb 12, 2015
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D Memory Arrays
- Publication number 20140217488
- Publication date Aug 7, 2014
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistors, Semiconductor Constructions, and Methods of Forming Se...
- Publication number 20140191340
- Publication date Jul 10, 2014
- Micron Technology, Inc.
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIR STEP FORMATION USING AT LEAST TWO MASKS
- Publication number 20140138840
- Publication date May 22, 2014
- Micron Technology, Inc.
- Chang Wan Ha
- H01 - BASIC ELECTRIC ELEMENTS

Deepak Thimmegowda

Person

Patents Grantslast 30 patents

Block-to-block isolation and deep contact using pillars in a memory...

Asymmetric junctions of high voltage transistor in NAND flash memory

Transistors, semiconductor constructions, and methods of forming se...

Memory array having connections going through control gates

Devices including stair step structures, and related apparatuses an...

Memory device with vertical string drivers

Memory array having connections going through control gates

Memory devices and related methods

Three dimensional storage cell array with highly dense and scalable...

Wordline bridge in a 3D memory array

Semiconductor constructions which include metal-containing gate por...

Stair step formation using at least two masks

Three dimensional storage cell array with highly dense and scalable...

Stair step formation using at least two masks

Performing read operations on a memory device

Methods of forming semiconductor constructions

Memory array having connections going through control gates

Apparatuses and methods for die seal crack detection

Stair step formation using at least two masks

Apparatuses and methods for die seal crack detection

3-D memory arrays

Transistors, semiconductor constructions, and methods of forming se...

Stair step formation using at least two masks

Transistors and semiconductor constructions

Stair step formation using at least two masks

Patents Applicationslast 30 patents

PARALLEL STAIRCASE 3D NAND

3D NAND WITH IO CONTACTS IN ISOLATION TRENCH

BLOCK-TO-BLOCK ISOLATION AND DEEP CONTACT USING PILLARS IN A MEMORY...

SPLIT BLOCK ARRAY FOR 3D NAND MEMORY

MEMORY ARRAY HAVING CONNECTIONS GOING THROUGH CONTROL GATES

ASYMMETRIC JUNCTIONS OF HIGH VOLTAGE TRANSISTOR IN NAND FLASH MEMORY

MEMORY ARRAY HAVING CONNECTIONS GOING THROUGH CONTROL GATES

DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED APPARATUSES AN...

VERTICAL STRING DRIVER WITH EXTENDED GATE JUNCTION STRUCTURE

VERTICAL STRING DRIVER WITH CHANNEL FIELD MANAGEMENT STRUCTURE

MEMORY DEVICE WITH A SPLIT STAIRCASE

Transistors, Semiconductor Constructions, and Methods of Forming Se...

MEMORY DEVICES AND RELATED METHODS

MEMORY DEVICE WITH VERTICAL STRING DRIVERS

WORDLINE BRIDGE IN A 3D MEMORY ARRAY

THREE DIMENSIONAL STORAGE CELL ARRAY WITH HIGHLY DENSE AND SCALABLE...

STAIR STEP FORMATION USING AT LEAST TWO MASKS

THREE DIMENSIONAL STORAGE CELL ARRAY WITH HIGHLY DENSE AND SCALABLE...

MEMORY ARRAY HAVING CONNECTIONS GOING THROUGH CONTROL GATES

Transistors, Semiconductor Constructions, and Methods of Forming Se...

STAIR STEP FORMATION USING AT LEAST TWO MASKS

APPARATUSES AND METHODS FOR DIE SEAL CRACK DETECTION

Transistors, Semiconductor Constructions, and Methods of Forming Se...

THROUGH ARRAY ROUTING FOR NON-VOLATILE MEMORY

STAIR STEP FORMATION USING AT LEAST TWO MASKS

APPARATUSES AND METHODS FOR DIE SEAL CRACK DETECTION

Transistors, Semiconductor Constructions, and Methods of Forming Se...

3-D Memory Arrays

Transistors, Semiconductor Constructions, and Methods of Forming Se...

STAIR STEP FORMATION USING AT LEAST TWO MASKS