Deepika Priyadarshini

Person

Guilderland, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure with manganese barrier layer
- Patent number 11,232,983
- Issue date Jan 25, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave plasma and ultraviolet assisted deposition apparatus and...
- Patent number 11,186,911
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Alfred Grill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microwave plasma and ultraviolet assisted deposition apparatus and...
- Patent number 11,066,748
- Issue date Jul 20, 2021
- International Business Machines Corporation
- Alfred Grill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method for equal substrate to channel height between...
- Patent number 11,043,494
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 10,770,347
- Issue date Sep 8, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 10,593,591
- Issue date Mar 17, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature diffusion doping of copper interconnects independen...
- Patent number 10,580,740
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave plasma and ultraviolet assisted deposition apparatus and...
- Patent number 10,428,428
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Alfred Grill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method for equal substrate to channel height between...
- Patent number 10,381,348
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap and air spacer pinch off
- Patent number 10,366,940
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure with manganese oxide barrier layer
- Patent number 10,325,806
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap and air spacer pinch off
- Patent number 10,256,171
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust high performance low hydrogen silicon carbon nitride (SiCNH)...
- Patent number 10,242,865
- Issue date Mar 26, 2019
- International Business Machines Corporation
- Thomas J. Haigh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Air gap and air spacer pinch off
- Patent number 10,242,933
- Issue date Mar 26, 2019
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust high performance low hydrogen silicon carbon nitride (SiCNH)...
- Patent number 10,236,176
- Issue date Mar 19, 2019
- International Business Machines Corporation
- Thomas J. Haigh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Separate N and P fin etching for reduced CMOS device leakage
- Patent number 10,229,910
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Isabel C. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure with manganese oxide barrier layer
- Patent number 10,224,241
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite manganese nitride / low-k dielectric cap
- Patent number 10,224,283
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Donald F. Canaperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer dielectric structures with graded composition for nano-s...
- Patent number 10,211,047
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature diffusion doping of copper interconnects independen...
- Patent number 10,192,829
- Issue date Jan 29, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap and air spacer pinch off
- Patent number 10,177,076
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge trim processes and resultant structures
- Patent number 10,134,577
- Issue date Nov 20, 2018
- GLOBALFOUNDRIES Inc.
- Richard F. Indyk
- B32 - LAYERED PRODUCTS
Information Patent Grant
Air gap semiconductor structure with selective cap bilayer
- Patent number 9,960,117
- Issue date May 1, 2018
- International Business Machines Corporation
- Stephen M. Gates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure with manganese oxide barrier layer
- Patent number 9,947,579
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a copper based interconnect structure
- Patent number 9,947,581
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/me...
- Patent number 9,947,622
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Donald F. Canaperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer dielectric structures with graded composition for nano-s...
- Patent number 9,934,963
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap and air spacer pinch off
- Patent number 9,793,193
- Issue date Oct 17, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap and air spacer pinch off
- Patent number 9,786,760
- Issue date Oct 10, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER
- Publication number 20220115269
- Publication date Apr 14, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20200402848
- Publication date Dec 24, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20200051854
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE PLASMA AND ULTRAVIOLET ASSISTED DEPOSITION APPARATUS AND...
- Publication number 20190368045
- Publication date Dec 5, 2019
- International Business Machines Corporation
- Alfred Grill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROWAVE PLASMA AND ULTRAVIOLET ASSISTED DEPOSITION APPARATUS AND...
- Publication number 20190368044
- Publication date Dec 5, 2019
- International Business Machines Corporation
- Alfred Grill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE AND METHOD FOR EQUAL SUBSTRATE TO CHANNEL HEIGHT BETWEEN...
- Publication number 20190326289
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Lawrence A. CLEVENGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH)...
- Publication number 20190172704
- Publication date Jun 6, 2019
- International Business Machines Corporation
- Thomas J. Haigh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low-Temperature Diffusion Doping of Copper Interconnects Independen...
- Publication number 20190148303
- Publication date May 16, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20180374748
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR EQUAL SUBSTRATE TO CHANNEL HEIGHT BETWEEN...
- Publication number 20180197858
- Publication date Jul 12, 2018
- International Business Machines Corporation
- Lawrence A. CLEVENGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP AND AIR SPACER PINCH OFF
- Publication number 20180108596
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATE N AND P FIN ETCHING FOR REDUCED CMOS DEVICE LEAKAGE
- Publication number 20180097002
- Publication date Apr 5, 2018
- International Business Machines Corporation
- Isabel C. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP AND AIR SPACER PINCH OFF
- Publication number 20180090418
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20180090371
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP AND AIR SPACER PINCH OFF
- Publication number 20180090587
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP AND AIR SPACER PINCH OFF
- Publication number 20180090588
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20180082894
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER DIELECTRIC STRUCTURES WITH GRADED COMPOSITION FOR NANO-S...
- Publication number 20180047568
- Publication date Feb 15, 2018
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Temperature Diffusion Doping of Copper Interconnects Independen...
- Publication number 20170358533
- Publication date Dec 14, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE MANGANESE NITRIDE / LOW-K DIELECTRIC CAP
- Publication number 20170317032
- Publication date Nov 2, 2017
- International Business Machines Corporation
- Donald F. Canaperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH)...
- Publication number 20170263449
- Publication date Sep 14, 2017
- International Business Machines Corporation
- Thomas J. Haigh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH)...
- Publication number 20170263451
- Publication date Sep 14, 2017
- International Business Machines Corporation
- Thomas J. Haigh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE MANGANESE NITRIDE / LOW-K DIELECTRIC CAP
- Publication number 20170179034
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Donald F. Canaperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20170140981
- Publication date May 18, 2017
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Temperature Diffusion Doping of Copper Interconnects Independen...
- Publication number 20170084540
- Publication date Mar 23, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE PLASMA AND ULTRAVIOLET ASSISTED DEPOSITION APPARATUS AND...
- Publication number 20170002469
- Publication date Jan 5, 2017
- International Business Machines Corporation
- Alfred Grill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/ME...
- Publication number 20170005040
- Publication date Jan 5, 2017
- International Business Machines Corporation
- Donald F. Canaperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE TRIM PROCESSES AND RESULTANT STRUCTURES
- Publication number 20160343564
- Publication date Nov 24, 2016
- International Business Machines Corporation
- Richard F. INDYK
- B32 - LAYERED PRODUCTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20160329279
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- H01 - BASIC ELECTRIC ELEMENTS

Deepika Priyadarshini

Person

Patents Grantslast 30 patents

Method of forming copper interconnect structure with manganese barr...

Copper interconnect structure with manganese barrier layer

Microwave plasma and ultraviolet assisted deposition apparatus and...

Microwave plasma and ultraviolet assisted deposition apparatus and...

Structure and method for equal substrate to channel height between...

Interconnect structure

Interconnect structure

Low-temperature diffusion doping of copper interconnects independen...

Microwave plasma and ultraviolet assisted deposition apparatus and...

Structure and method for equal substrate to channel height between...

Air gap and air spacer pinch off

Copper interconnect structure with manganese oxide barrier layer

Air gap and air spacer pinch off

Robust high performance low hydrogen silicon carbon nitride (SiCNH)...

Air gap and air spacer pinch off

Robust high performance low hydrogen silicon carbon nitride (SiCNH)...

Separate N and P fin etching for reduced CMOS device leakage

Copper interconnect structure with manganese oxide barrier layer

Composite manganese nitride / low-k dielectric cap

Multilayer dielectric structures with graded composition for nano-s...

Low-temperature diffusion doping of copper interconnects independen...

Air gap and air spacer pinch off

Edge trim processes and resultant structures

Air gap semiconductor structure with selective cap bilayer

Copper interconnect structure with manganese oxide barrier layer

Method of forming a copper based interconnect structure

Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/me...

Multilayer dielectric structures with graded composition for nano-s...

Air gap and air spacer pinch off

Air gap and air spacer pinch off

Patents Applicationslast 30 patents

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER

INTERCONNECT STRUCTURE

INTERCONNECT STRUCTURE

MICROWAVE PLASMA AND ULTRAVIOLET ASSISTED DEPOSITION APPARATUS AND...

MICROWAVE PLASMA AND ULTRAVIOLET ASSISTED DEPOSITION APPARATUS AND...

STRUCTURE AND METHOD FOR EQUAL SUBSTRATE TO CHANNEL HEIGHT BETWEEN...

ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH)...

Low-Temperature Diffusion Doping of Copper Interconnects Independen...

INTERCONNECT STRUCTURE

STRUCTURE AND METHOD FOR EQUAL SUBSTRATE TO CHANNEL HEIGHT BETWEEN...

AIR GAP AND AIR SPACER PINCH OFF

SEPARATE N AND P FIN ETCHING FOR REDUCED CMOS DEVICE LEAKAGE

AIR GAP AND AIR SPACER PINCH OFF

INTERCONNECT STRUCTURE

AIR GAP AND AIR SPACER PINCH OFF

AIR GAP AND AIR SPACER PINCH OFF

INTERCONNECT STRUCTURE

MULTILAYER DIELECTRIC STRUCTURES WITH GRADED COMPOSITION FOR NANO-S...

Low-Temperature Diffusion Doping of Copper Interconnects Independen...

COMPOSITE MANGANESE NITRIDE / LOW-K DIELECTRIC CAP

ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH)...

ROBUST HIGH PERFORMANCE LOW HYDROGEN SILICON CARBON NITRIDE (SiCNH)...

COMPOSITE MANGANESE NITRIDE / LOW-K DIELECTRIC CAP

INTERCONNECT STRUCTURE

Low-Temperature Diffusion Doping of Copper Interconnects Independen...

MICROWAVE PLASMA AND ULTRAVIOLET ASSISTED DEPOSITION APPARATUS AND...

ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/ME...

EDGE TRIM PROCESSES AND RESULTANT STRUCTURES

INTERCONNECT STRUCTURE