Dejiang Chang

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 11,004,808
- Issue date May 11, 2021
- Cree, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package having different types of semiconductor dies atta...
- Patent number 9,997,476
- Issue date Jun 12, 2018
- Infineon Technologies AG
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH DIFFERENT TYPES OF SEMICONDUCTOR DIES ATTACHED TO A FL...
- Publication number 20210233877
- Publication date Jul 29, 2021
- Cree, Inc.
- Xikun ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Different Types of Semiconductor Dies Attached to a Fl...
- Publication number 20180254253
- Publication date Sep 6, 2018
- INFINEON TECHNOLOGIES AG
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Having Different Types of Semiconductor Dies Atta...
- Publication number 20170125362
- Publication date May 4, 2017
- INFINEON TECHNOLOGIES AG
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS