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Delphine Mathey
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Grenoble, FR
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last 30 patents
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Patent Grant
Perforated electronic package and method of fabrication
Patent number
9,196,590
Issue date
Nov 24, 2015
STMicroelectronics (Grenoble 2) SAS
Francis Steffen
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
PERFORATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
Publication number
20150262941
Publication date
Sep 17, 2015
STMicroelectronics (Grenoble 2) SAS
Francis Steffen
H01 - BASIC ELECTRIC ELEMENTS