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Deming Liu
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Hong Kong, HK
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last 30 patents
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Patent Grant
Apparatus and method for die attachment
Patent number
6,991,967
Issue date
Jan 31, 2006
ASM Assembly Automation Ltd.
Deming Liu
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Apparatus and method for die attachment
Publication number
20050186019
Publication date
Aug 25, 2005
ASM Assembly Automation Ltd
Deming Liu
H01 - BASIC ELECTRIC ELEMENTS