Dengfeng LI

Person

Shenzhen, CN

People

Patents Applicationslast 30 patents

Information Patent Application
SUPERCONDUCTING IMPEDANCE MATCHED PARAMETRIC AMPLIFIER
- Publication number 20240418758
- Publication date Dec 19, 2024
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Shuoming AN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CHIP PREPARATION METHOD AND SYSTEM, AND CHIP
- Publication number 20240334843
- Publication date Oct 3, 2024
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Jingjing HU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CIRCUIT LAYOUT PROCESSING
- Publication number 20240265185
- Publication date Aug 8, 2024
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Shengming MA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM FOR PREPARING JOSEPHSON JUNCTION
- Publication number 20230422634
- Publication date Dec 28, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dengfeng LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUANTUM CHIP AND METHOD FOR PREPARING THE SAME
- Publication number 20230419148
- Publication date Dec 28, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dengfeng LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PREPARING JOSEPHSON JUNCTION AND PRODUCTION LINE DEVICE
- Publication number 20230320234
- Publication date Oct 5, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Kunliang BU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH SILICON VIA INTERCONNECTION STRUCTURE AND METHOD OF FORMING...
- Publication number 20230307297
- Publication date Sep 28, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dengfeng LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER AND METHOD FOR FILLING SILICON VIA THEREOF
- Publication number 20230307293
- Publication date Sep 28, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dengfeng LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON-VIA STRUCTURE AND METHOD FOR PREPARING SAME, THROUG...
- Publication number 20230197572
- Publication date Jun 22, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Weiwen ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING METHOD FOR MAKING CHIP, CHIP SUBSTRATE, AND CHIP
- Publication number 20230099146
- Publication date Mar 30, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dengfeng LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Dengfeng LI

Person

Patents Applicationslast 30 patents

SUPERCONDUCTING IMPEDANCE MATCHED PARAMETRIC AMPLIFIER

CHIP PREPARATION METHOD AND SYSTEM, AND CHIP

CIRCUIT LAYOUT PROCESSING

METHOD AND SYSTEM FOR PREPARING JOSEPHSON JUNCTION

QUANTUM CHIP AND METHOD FOR PREPARING THE SAME

METHOD FOR PREPARING JOSEPHSON JUNCTION AND PRODUCTION LINE DEVICE

THROUGH SILICON VIA INTERCONNECTION STRUCTURE AND METHOD OF FORMING...

SILICON WAFER AND METHOD FOR FILLING SILICON VIA THEREOF

THROUGH-SILICON-VIA STRUCTURE AND METHOD FOR PREPARING SAME, THROUG...

COATING METHOD FOR MAKING CHIP, CHIP SUBSTRATE, AND CHIP