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Denis Morrissey

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  • Huntington, NY, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Methods for metallizing an aluminum paste
    • Patent number 9,202,946
    • Issue date Dec 1, 2015
    • OMG Electronic Chemicals, Inc.
    • Richard Bellemare
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Seed layer repair
    • Patent number 6,797,146
    • Issue date Sep 28, 2004
    • Shipley Company, L.L.C.
    • Denis Morrissey
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of electrodepositing copper
    • Patent number 6,679,983
    • Issue date Jan 20, 2004
    • Shipley Company, L.L.C.
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Seed layer
    • Patent number 6,660,154
    • Issue date Dec 9, 2003
    • Shipley Company, L.L.C.
    • David Merricks
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Seed layer repair bath
    • Patent number 6,660,153
    • Issue date Dec 9, 2003
    • Shipley Company, L.L.C.
    • David Merricks
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electroplating method
    • Patent number 6,649,038
    • Issue date Nov 18, 2003
    • Shipley Company, L.L.C.
    • Robert D. Mikkola
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Copper electroplating
    • Patent number 6,610,192
    • Issue date Aug 26, 2003
    • Shipley Company, L.L.C.
    • Eugene N. Step
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Seed layer repair method
    • Patent number 6,531,046
    • Issue date Mar 11, 2003
    • Shipley Company, L.L.C.
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Control of breakdown products in electroplating baths
    • Patent number 6,508,924
    • Issue date Jan 21, 2003
    • Shipley Company LLC
    • Luis A. Gomez
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    METHODS FOR METALLIZING AN ALUMINUM PASTE
    • Publication number 20140227827
    • Publication date Aug 14, 2014
    • Richard Bellemare
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Seed layer processes
    • Publication number 20020134684
    • Publication date Sep 26, 2002
    • Shipley Company, L.L.C.
    • Jeffrey M. Calvert
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Seed layer repair bath
    • Publication number 20020088713
    • Publication date Jul 11, 2002
    • Shipley Company, L.L.C.
    • David Merricks
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath
    • Publication number 20020090484
    • Publication date Jul 11, 2002
    • Shipley Company, L.L.C.
    • David Merricks
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Seed layer
    • Publication number 20020084193
    • Publication date Jul 4, 2002
    • Shipley Company, L.L.C.
    • David Merricks
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Seed layer recovery
    • Publication number 20020074242
    • Publication date Jun 20, 2002
    • Shipley Company, L.L.C.
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Seed layer repair
    • Publication number 20020053519
    • Publication date May 9, 2002
    • Shipley Company, L.L.C.
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electrolyte
    • Publication number 20020043467
    • Publication date Apr 18, 2002
    • Shipley Company, L.L.C.
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Seed layer repair method
    • Publication number 20020000382
    • Publication date Jan 3, 2002
    • Shipley Company, L.L.C. of Marlborough
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR