Deniz TURAN

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier chuck and methods of forming and using thereof
- Patent number 12,327,749
- Issue date Jun 10, 2025
- Intel Corporation
- Deniz Turan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...
- Publication number 20250112162
- Publication date Apr 3, 2025
- Intel Corporation
- Zheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SUBSTRATE BUMP HEIGHT
- Publication number 20250112164
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTR...
- Publication number 20250096052
- Publication date Mar 20, 2025
- Intel Corporation
- Mohamed R. Saber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION
- Publication number 20240332153
- Publication date Oct 3, 2024
- Intel Corporation
- Tchefor NDUKUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY METHOD FOR METAL-DEFINED PAD FORMATION
- Publication number 20240181572
- Publication date Jun 6, 2024
- Intel Corporation
- Tchefor NDUKUM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE
- Publication number 20240178157
- Publication date May 30, 2024
- Intel Corporation
- Vinith BEJUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF
- Publication number 20240096678
- Publication date Mar 21, 2024
- Intel Corporation
- Deniz TURAN
- H01 - BASIC ELECTRIC ELEMENTS

Deniz TURAN

Person

Patents Grantslast 30 patents

Carrier chuck and methods of forming and using thereof

Patents Applicationslast 30 patents

DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...

CONTROLLING SUBSTRATE BUMP HEIGHT

LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTR...

DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION

DRY METHOD FOR METAL-DEFINED PAD FORMATION

SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE

CARRIER CHUCK AND METHODS OF FORMING AND USING THEREOF