Dennis B. Miller

Person

Barrington, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assembly with connection to a buried electrical ele...
- Patent number 6,200,829
- Issue date Mar 13, 2001
- Motorola, Inc.
- Dennis Brian Miller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic assembly with connection to a buried electrical ele...
- Patent number 5,898,215
- Issue date Apr 27, 1999
- Motorola, Inc.
- Dennis Brian Miller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic assembly for connection to an embedded electrical e...
- Patent number 5,856,912
- Issue date Jan 5, 1999
- Motorola Inc.
- Dennis Brian Miller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming a microelectronic assembly
- Patent number 5,848,466
- Issue date Dec 15, 1998
- Motorola, Inc.
- Daniel Joseph Viza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder bumps on bond pads
- Patent number 5,829,668
- Issue date Nov 3, 1998
- Motorola Corporation
- Reed A. George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum pickup tool for placing balls in a customized pattern
- Patent number 5,749,614
- Issue date May 12, 1998
- Motorola, Inc.
- Ellen Margaret Reid
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Tin bismuth solder paste, and method using paste to form connection...
- Patent number 5,429,292
- Issue date Jul 4, 1995
- Motorola, Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin bismuth solder paste, and method using paste to form connection...
- Patent number 5,389,160
- Issue date Feb 14, 1995
- Motorola, Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular optical waveguide and method for making
- Patent number 5,325,451
- Issue date Jun 28, 1994
- Motorola, Inc.
- Davis Hartman
- G02 - OPTICS
Information Patent Grant
Electrical component package comprising polymer-reinforced solder b...
- Patent number 5,120,678
- Issue date Jun 9, 1992
- Motorola Inc.
- Kevin D. Moore
- H01 - BASIC ELECTRIC ELEMENTS

Dennis B. Miller

Person

Patents Grantslast 30 patents

Microelectronic assembly with connection to a buried electrical ele...

Microelectronic assembly with connection to a buried electrical ele...

Microelectronic assembly for connection to an embedded electrical e...

Method for forming a microelectronic assembly

Method for forming solder bumps on bond pads

Vacuum pickup tool for placing balls in a customized pattern

Tin bismuth solder paste, and method using paste to form connection...

Tin bismuth solder paste, and method using paste to form connection...

Modular optical waveguide and method for making

Electrical component package comprising polymer-reinforced solder b...