Dennis Buese

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O'Fallon, MO, US

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Patents Grantslast 30 patents

Information Patent Grant
Dressing a wafer polishing pad
- Patent number 7,846,006
- Issue date Dec 7, 2010
- MEMC Electronic Materials, Inc.
- Mark G. Stinson
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for dressing a wafer polishing pad
- Patent number 7,846,007
- Issue date Dec 7, 2010
- MEMC Electronic Materials, Inc.
- Mark G. Stinson
- B24 - GRINDING POLISHING
Information Patent Grant
Process for reducing surface variations for polished wafer
- Patent number 6,479,386
- Issue date Nov 12, 2002
- MEMC Electronic Materials, Inc.
- Kan-Yin Ng
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus to place wafers into and out of machine
- Patent number 6,398,631
- Issue date Jun 4, 2002
- MEMC Electronic Materials, Inc.
- Gary L. Anderson
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and process for high temperature wafer edge polishing
- Patent number 6,257,954
- Issue date Jul 10, 2001
- MEMC Electronic Materials, Inc.
- Kan-Yin Ng
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR DRESSING A WAFER POLISHING PAD
- Publication number 20090176441
- Publication date Jul 9, 2009
- MEMC Electronic Materials, Inc.
- Mark G. Stinson
- B24 - GRINDING POLISHING
Information Patent Application
Dressing a Wafer Polishing Pad
- Publication number 20080009231
- Publication date Jan 10, 2008
- MEMC Electronic Materials, Inc.
- Mark G. Stinson
- B24 - GRINDING POLISHING