Dennis Ciplickas

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Collaborative learning model for semiconductor applications
- Patent number 12,038,802
- Issue date Jul 16, 2024
- PDF Solutions, Inc.
- Tomonori Honda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems, devices, and methods for performing a non-contact electric...
- Patent number 12,038,476
- Issue date Jul 16, 2024
- PDF Solutions, Inc.
- Indranil De
- G01 - MEASURING TESTING
Information Patent Grant
Systems, devices, and methods for performing a non-contact electric...
- Patent number 11,668,746
- Issue date Jun 6, 2023
- PDF Solutions, Inc.
- Indranil De
- G01 - MEASURING TESTING
Information Patent Grant
Methods for performing a non-contact electrical measurement on a ce...
- Patent number 11,340,293
- Issue date May 24, 2022
- PDF Solutions, Inc.
- Indranil De
- G01 - MEASURING TESTING
Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,107,804
- Issue date Aug 31, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G01 - MEASURING TESTING
Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,081,476
- Issue date Aug 3, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,081,477
- Issue date Aug 3, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures and E-beam pads embedded within a contiguou...
- Patent number 11,075,194
- Issue date Jul 27, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,018,126
- Issue date May 25, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G01 - MEASURING TESTING
Information Patent Grant
IC with test structures and E-beam pads embedded within a contiguou...
- Patent number 10,978,438
- Issue date Apr 13, 2021
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,854,522
- Issue date Dec 1, 2020
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC with test structures embedded within a contiguous standard cell...
- Patent number 10,777,472
- Issue date Sep 15, 2020
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making semiconductor dies, chips, and wafers using in-l...
- Patent number 10,593,604
- Issue date Mar 17, 2020
- PDF Solutions, Inc.
- Stephen Lam
- G01 - MEASURING TESTING
Information Patent Grant
Methods for processing a semiconductor wafer using non-contact elec...
- Patent number 10,290,552
- Issue date May 14, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit containing first and second DOEs of standard Cel...
- Patent number 10,269,786
- Issue date Apr 23, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,211,112
- Issue date Feb 19, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,211,111
- Issue date Feb 19, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,290
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,284
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,285
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,288
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor water using non-contact elect...
- Patent number 10,199,293
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wager using non-contact elect...
- Patent number 10,199,283
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,287
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,294
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,286
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for processing a semiconductor wafer using non-contact elect...
- Patent number 10,199,289
- Issue date Feb 5, 2019
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including NCEM-enabled, tip-to-side gap-configur...
- Patent number 10,109,539
- Issue date Oct 23, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for making and using a semiconductor wafer containing first...
- Patent number 10,096,529
- Issue date Oct 9, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for making and using a semiconductor wafer containing first...
- Patent number 10,096,530
- Issue date Oct 9, 2018
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS, DEVICES, AND METHODS FOR PERFORMING A NON-CONTACT ELECTRIC...
- Publication number 20240329128
- Publication date Oct 3, 2024
- PDF Solutions, Inc.
- Indranil DE
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS, DEVICES, AND METHODS FOR PERFORMING A NON-CONTACT ELECTRIC...
- Publication number 20230358804
- Publication date Nov 9, 2023
- PDF Solutions, Inc.
- Indranil DE
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS, DEVICES, AND METHODS FOR PERFORMING A NON-CONTACT ELECTRIC...
- Publication number 20220365134
- Publication date Nov 17, 2022
- PDF SOLUTIONS, INC.
- Indranil DE
- G01 - MEASURING TESTING
Information Patent Application
Collaborative Learning Model for Semiconductor Applications
- Publication number 20210142122
- Publication date May 13, 2021
- PDF Solutions, Inc.
- Tomonori Honda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS, DEVICES, AND METHODS FOR PERFORMING A NON-CONTACT ELECTRIC...
- Publication number 20210096179
- Publication date Apr 1, 2021
- Indranil DE
- G01 - MEASURING TESTING
Information Patent Application
Integrated Circuit Containing DOEs of NCEM-enabled Fill Cells
- Publication number 20170178981
- Publication date Jun 22, 2017
- PDF Solutions, Inc.
- Stephen Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
E-BEAM INSPECTION APPARATUS AND METHOD OF USING THE SAME ON VARIOUS...
- Publication number 20160118217
- Publication date Apr 28, 2016
- PDF Solutions, Inc.
- Indranil De
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPPORTUNISTIC PLACEMENT OF IC TEST STRUCUTRES AND/OR E-BEAM TARGET...
- Publication number 20150270181
- Publication date Sep 24, 2015
- PDF Solutions, Inc.
- Indranil De
- G01 - MEASURING TESTING
Information Patent Application
Generalization of the Photo Process Window and Its Application to O...
- Publication number 20080295061
- Publication date Nov 27, 2008
- Hans Eisenmann
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
System And Method For Product Yield Prediction
- Publication number 20080282210
- Publication date Nov 13, 2008
- PDF Solutions, Inc.
- Brian E. Stine
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for product yield prediction
- Publication number 20070118242
- Publication date May 24, 2007
- PDF Solutions, Inc.
- Brian E. Stine
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for product yield prediction
- Publication number 20060277506
- Publication date Dec 7, 2006
- PDF Solutions, Inc.
- Brian E. Stine
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Fast localization of electrical failures on an integrated circuit s...
- Publication number 20060105475
- Publication date May 18, 2006
- Dennis Ciplickas
- G01 - MEASURING TESTING
Information Patent Application
Yield improvement
- Publication number 20060101355
- Publication date May 11, 2006
- PDF Solutions, Inc.
- Dennis Ciplickas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for product yield prediction
- Publication number 20050158888
- Publication date Jul 21, 2005
- PDF Solutions, Inc.
- Brian E. Stine
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Back end of line clone test vehicle
- Publication number 20050086617
- Publication date Apr 21, 2005
- Dennis J. Ciplickas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test structures and models for estimating the yield impact of dishi...
- Publication number 20050074908
- Publication date Apr 7, 2005
- Dennis J. Ciplickas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test structures for estimating dishing and erosion effects in coppe...
- Publication number 20040232910
- Publication date Nov 25, 2004
- Dennis J Ciplickas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extraction method of defect density and size distributions
- Publication number 20040094762
- Publication date May 20, 2004
- Christopher Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for product yield prediction
- Publication number 20030145292
- Publication date Jul 31, 2003
- Brian E. Stine
- G06 - COMPUTING CALCULATING COUNTING

Dennis Ciplickas

Person

Patents Grantslast 30 patents

Collaborative learning model for semiconductor applications

Systems, devices, and methods for performing a non-contact electric...

Systems, devices, and methods for performing a non-contact electric...

Methods for performing a non-contact electrical measurement on a ce...

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and E-beam pads embedded within a contiguou...

IC with test structures and e-beam pads embedded within a contiguou...

IC with test structures and E-beam pads embedded within a contiguou...

Method for processing a semiconductor wafer using non-contact elect...

IC with test structures embedded within a contiguous standard cell...

Process for making semiconductor dies, chips, and wafers using in-l...

Methods for processing a semiconductor wafer using non-contact elec...

Integrated circuit containing first and second DOEs of standard Cel...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor water using non-contact elect...

Method for processing a semiconductor wager using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Method for processing a semiconductor wafer using non-contact elect...

Integrated circuit including NCEM-enabled, tip-to-side gap-configur...

Process for making and using a semiconductor wafer containing first...

Process for making and using a semiconductor wafer containing first...

Patents Applicationslast 30 patents

SYSTEMS, DEVICES, AND METHODS FOR PERFORMING A NON-CONTACT ELECTRIC...

SYSTEMS, DEVICES, AND METHODS FOR PERFORMING A NON-CONTACT ELECTRIC...

SYSTEMS, DEVICES, AND METHODS FOR PERFORMING A NON-CONTACT ELECTRIC...

Collaborative Learning Model for Semiconductor Applications

SYSTEMS, DEVICES, AND METHODS FOR PERFORMING A NON-CONTACT ELECTRIC...

Integrated Circuit Containing DOEs of NCEM-enabled Fill Cells

E-BEAM INSPECTION APPARATUS AND METHOD OF USING THE SAME ON VARIOUS...

OPPORTUNISTIC PLACEMENT OF IC TEST STRUCUTRES AND/OR E-BEAM TARGET...

Generalization of the Photo Process Window and Its Application to O...

System And Method For Product Yield Prediction

System and method for product yield prediction

System and method for product yield prediction

Fast localization of electrical failures on an integrated circuit s...

Yield improvement

System and method for product yield prediction

Back end of line clone test vehicle

Test structures and models for estimating the yield impact of dishi...

Test structures for estimating dishing and erosion effects in coppe...

Extraction method of defect density and size distributions

System and method for product yield prediction