Dennis C.P. Leung

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device having a multi-layer substrate and a meth...
- Patent number 8,198,724
- Issue date Jun 12, 2012
- Xilinx, Inc.
- Paul Ying-Fung Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER CORE ORGANIC PACKAGE SUBSTRATE
- Publication number 20140262440
- Publication date Sep 18, 2014
- Xilinx, Inc.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS