Dennis Kwok-Wai YEE

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Fanling, CN

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Patents Grantslast 30 patents

Information Patent Grant
Formaldehyde free electroless copper plating compositions and methods
- Patent number 9,809,883
- Issue date Nov 7, 2017
- Rohm and Haas Electronic Materials LLC
- Andy Lok-Fung Chow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for electroless plating and a solution used for the same
- Patent number 9,499,910
- Issue date Nov 22, 2016
- Rohm and Haas Electronic Materials LLC
- Dennis Kwok-Wai Yee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS
- Publication number 20150376795
- Publication date Dec 31, 2015
- Rohm and Haas Electronic Materials L.L.C.
- Andy Lok-Fung Chow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME
- Publication number 20150322574
- Publication date Nov 12, 2015
- Rohm and Haas Electronic Materials L.L.C.
- Dennis Kwok-Wai YEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...