Dennis L. Cardoza

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Brentwood, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-section package for a mold release agent and a wipe
- Patent number 7,717,257
- Issue date May 18, 2010
- Henkel Corporation
- Zheng Lu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL