Dennis L. Krause

Person

Atkinson, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin film metallization for barium nanotitanate substrates
- Patent number 5,779,929
- Issue date Jul 14, 1998
- Lucent Technologies Inc.
- Tae Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization for polymer-dielectric multichip modules
- Patent number 5,622,895
- Issue date Apr 22, 1997
- Lucent Technologies Inc.
- Aaron L. Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization for polymer-dielectric multichip modules including a...
- Patent number 5,466,972
- Issue date Nov 14, 1995
- AT&T Corp.
- Aaron L. Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for planar magnetron sputtering
- Patent number 5,441,614
- Issue date Aug 15, 1995
- AT&T Corp.
- Dennis L. Krause
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper-based metallizations for hybrid integrated circuits
- Patent number 5,356,526
- Issue date Oct 18, 1994
- AT&T Bell Laboratories
- Robert P. Frankenthal
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper-based metallizations for hybrid integrated circuits
- Patent number 5,288,951
- Issue date Feb 22, 1994
- AT&T Bell Laboratories
- Robert P. Frankenthal
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High temperature superconductor deposition by sputtering
- Patent number 5,196,400
- Issue date Mar 23, 1993
- AT&T Bell Laboratories
- Chiou T. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film-type electrical substrate circuit device and method of forming...
- Patent number 4,539,434
- Issue date Sep 3, 1985
- AT&T Technologies, Inc.
- Dennis L. Krause
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of and apparatus for sputtering material onto a substrate
- Patent number 4,491,509
- Issue date Jan 1, 1985
- AT&T Technologies, Inc.
- Dennis L. Krause
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Dennis L. Krause

Person

Patents Grantslast 30 patents

Thin film metallization for barium nanotitanate substrates

Metallization for polymer-dielectric multichip modules

Metallization for polymer-dielectric multichip modules including a...

Method and apparatus for planar magnetron sputtering

Copper-based metallizations for hybrid integrated circuits

Copper-based metallizations for hybrid integrated circuits

High temperature superconductor deposition by sputtering

Film-type electrical substrate circuit device and method of forming...

Methods of and apparatus for sputtering material onto a substrate