Dennis Lee Conner

Person

Glendale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,984,388
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,710,686
- Issue date Jul 25, 2023
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,217,515
- Issue date Jan 4, 2022
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 10,522,448
- Issue date Dec 31, 2019
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holes and dimples to control solder flow
- Patent number 9,911,684
- Issue date Mar 6, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 9,870,986
- Issue date Jan 16, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation method
- Patent number 9,847,219
- Issue date Dec 19, 2017
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single or multi chip module package and related methods
- Patent number 9,558,968
- Issue date Jan 31, 2017
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation method
- Patent number 9,484,210
- Issue date Nov 1, 2016
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation method
- Patent number 9,034,733
- Issue date May 19, 2015
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation method
- Patent number 8,664,089
- Issue date Mar 4, 2014
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20230317576
- Publication date Oct 5, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20220084920
- Publication date Mar 17, 2022
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20190385939
- Publication date Dec 19, 2019
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
- Publication number 20180096925
- Publication date Apr 5, 2018
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLES AND DIMPLES TO CONTROL SOLDER FLOW
- Publication number 20180053712
- Publication date Feb 22, 2018
- Semiconductor Components Industries, LLC
- Stephen ST. GERMAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
- Publication number 20170110391
- Publication date Apr 20, 2017
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20170004965
- Publication date Jan 5, 2017
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS
- Publication number 20160079095
- Publication date Mar 17, 2016
- Semiconductor Components Industries, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20150228494
- Publication date Aug 13, 2015
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20140134828
- Publication date May 15, 2014
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20140051232
- Publication date Feb 20, 2014
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS

Dennis Lee Conner

Person

Patents Grantslast 30 patents

Semiconductor package structures and methods of manufacture

Semiconductor package structures and methods of manufacture

Semiconductor package structures and methods of manufacture

Single or multi chip module package and related methods

Holes and dimples to control solder flow

Single or multi chip module package and related methods

Semiconductor die singulation method

Single or multi chip module package and related methods

Semiconductor die singulation method

Semiconductor die singulation method

Semiconductor die singulation method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURE

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

HOLES AND DIMPLES TO CONTROL SOLDER FLOW

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

SEMICONDUCTOR DIE SINGULATION METHOD

SINGLE OR MULTI CHIP MODULE PACKAGE AND RELATED METHODS

SEMICONDUCTOR DIE SINGULATION METHOD

SEMICONDUCTOR DIE SINGULATION METHOD

SEMICONDUCTOR DIE SINGULATION METHOD