Dennis Pai

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Hsinchu Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Image sensor having an improved package structure
- Patent number 6,740,967
- Issue date May 25, 2004
- Kingpak Technology Inc.
- Dennis Pai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing memory card structure
- Publication number 20070246544
- Publication date Oct 25, 2007
- Sheila Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Memory card structure and method for manufacturing the same
- Publication number 20070216037
- Publication date Sep 20, 2007
- Dennis Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for re-forming BGA of a semiconductor package
- Publication number 20070049000
- Publication date Mar 1, 2007
- Jay Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Jig structure for manufacturin a stacked memory card
- Publication number 20070029655
- Publication date Feb 8, 2007
- Hong Tsu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked memory card and method for manufacturing the same
- Publication number 20060289980
- Publication date Dec 28, 2006
- Hong Tsu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package structure
- Publication number 20040251532
- Publication date Dec 16, 2004
- Potter Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for removing an image sensor from a printed circuit board
- Publication number 20040194992
- Publication date Oct 7, 2004
- Dennis Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR