Dennis R. Pyper

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked printed circuit board packages
- Patent number 10,631,410
- Issue date Apr 21, 2020
- Apple Inc.
- Corey S. Provencher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-profile space-efficient shielding for SIP module
- Patent number 10,624,214
- Issue date Apr 14, 2020
- Apple Inc.
- Amir Salehi
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Circuit substrate with embedded heat sink
- Patent number 10,470,307
- Issue date Nov 5, 2019
- Apple Inc.
- Dennis R. Pyper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked circuit board architecture in an electronic device
- Patent number 10,455,738
- Issue date Oct 22, 2019
- Apple Inc.
- David A. Pakula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit substrate with embedded heat sink
- Patent number 10,034,375
- Issue date Jul 24, 2018
- Apple Inc.
- Dennis R. Pyper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector inserts and receptacle tongues formed using printed circu...
- Patent number 9,992,863
- Issue date Jun 5, 2018
- Apple Inc.
- Mahmoud R. Amini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microphone assembly having an acoustic leak path
- Patent number 9,888,307
- Issue date Feb 6, 2018
- Apple Inc.
- Nikolas T. Vitt
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low-area overhead connectivity solutions to SIP module
- Patent number 9,839,133
- Issue date Dec 5, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with compact groups of devices
- Patent number 9,743,522
- Issue date Aug 22, 2017
- Apple Inc.
- Xingqun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuits with embedded strain gauges
- Patent number 9,593,991
- Issue date Mar 14, 2017
- Apple Inc.
- Anne M. Mason
- G01 - MEASURING TESTING
Information Patent Grant
Liquid-based pressure sensitive adhesive for grounding applications
- Patent number 9,258,906
- Issue date Feb 9, 2016
- Apple Inc.
- James R. Krogdahl
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed circuit board with integral radio-frequency shields
- Patent number 9,226,435
- Issue date Dec 29, 2015
- Apple Inc.
- Joseph Fisher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna structures and shield layers on packaged wireless circuits
- Patent number 9,196,958
- Issue date Nov 24, 2015
- Apple Inc.
- Shawn Xavier Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shielding techniques
- Patent number 9,155,188
- Issue date Oct 6, 2015
- Apple Inc.
- Nicholas G. Merz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three dimensional passive multi-component structures
- Patent number 8,942,002
- Issue date Jan 27, 2015
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-part substrate assemblies for low profile portable electronic...
- Patent number 8,879,272
- Issue date Nov 4, 2014
- Apple Inc.
- Kyle H. Yeates
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing vias through a modular component
- Patent number 8,861,217
- Issue date Oct 14, 2014
- Apple Inc.
- Gloria Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods for embedding semiconductors in printed circuit...
- Patent number 8,809,859
- Issue date Aug 19, 2014
- Apple Inc.
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three dimensional passive multi-component structures
- Patent number 8,767,408
- Issue date Jul 1, 2014
- Apple Inc.
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods for embedding semiconductors in printed circuit...
- Patent number 8,664,656
- Issue date Mar 4, 2014
- Apple Inc.
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with integral radio-frequency shields
- Patent number 8,654,537
- Issue date Feb 18, 2014
- Apple Inc.
- Joseph Fisher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing a system-on-a-substrate
- Patent number 8,334,704
- Issue date Dec 18, 2012
- Apple Inc.
- Gloria Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing vias through a modular component
- Patent number 8,310,835
- Issue date Nov 13, 2012
- Apple Inc.
- Gloria Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-part substrate assemblies for low profile portable electronic...
- Patent number 8,072,764
- Issue date Dec 6, 2011
- Apple Inc.
- Kyle H. Yeates
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Circuit substrate with embedded heat sink
- Publication number 20180310407
- Publication date Oct 25, 2018
- Apple Inc.
- Dennis R. Pyper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED PRINTED CIRCUIT BOARD PACKAGES
- Publication number 20180092213
- Publication date Mar 29, 2018
- Apple Inc.
- Corey S. Provencher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED CIRCUIT BOARD ARCHITECTURE IN AN ELECTRONIC DEVICE
- Publication number 20180084636
- Publication date Mar 22, 2018
- Apple Inc.
- David A. PAKULA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROPHONE ASSEMBLY HAVING AN ACOUSTIC LEAK PATH
- Publication number 20170164084
- Publication date Jun 8, 2017
- Apple Inc.
- Nikolas T. Vitt
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Printed Circuits With Embedded Strain Gauges
- Publication number 20170030784
- Publication date Feb 2, 2017
- Apple Inc.
- Anne M. Mason
- G01 - MEASURING TESTING
Information Patent Application
Circuit substrate with embedded heat sink
- Publication number 20160345423
- Publication date Nov 24, 2016
- Apple Inc.
- Dennis R. Pyper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-PROFILE SPACE-EFFICIENT SHIELDING FOR SIP MODULE
- Publication number 20160270213
- Publication date Sep 15, 2016
- Apple Inc.
- Amir Salehi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-AREA OVERHEAD CONNECTIVITY SOLUTIONS TO SIP MODULE
- Publication number 20160021756
- Publication date Jan 21, 2016
- Apple Inc.
- Meng Chi Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEEL FILLET CAPACITOR WITH NOISE REDUCTION
- Publication number 20150364253
- Publication date Dec 17, 2015
- Apple Inc.
- Shawn X. Arnold
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
LOW AREA OVER-HEAD CONNECTIVITY SOLUTIONS TO SIP MODULE
- Publication number 20150359099
- Publication date Dec 10, 2015
- Apple Inc.
- Shankar Pennathur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR INSERTS AND RECEPTACLE TONGUES FORMED USING PRINTED CIRCU...
- Publication number 20150131245
- Publication date May 14, 2015
- Apple Inc.
- Mahmoud R. Amini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid-Based Pressure Sensitive Adhesive for Grounding Applications
- Publication number 20140308465
- Publication date Oct 16, 2014
- Apple Inc.
- James R. Krogdahl
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Printed Circuit Board With Integral Radio-Frequency Shields
- Publication number 20140146495
- Publication date May 29, 2014
- Apple Inc.
- Joseph Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR EMBEDDING SEMICONDUCTORS IN PRINTED CIRCUIT...
- Publication number 20140134760
- Publication date May 15, 2014
- Apple Inc.
- Shawn X. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board with compact groups of devices
- Publication number 20140085850
- Publication date Mar 27, 2014
- Xingqun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD ASSEMBLIES WITH MINIMIZED WARPAGE AND SYSTEMS AND METHODS FOR...
- Publication number 20140055969
- Publication date Feb 27, 2014
- Apple Inc.
- Vu Thanh Vo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Antenna Structures and Shield Layers on Packaged Wireless Circuits
- Publication number 20140028518
- Publication date Jan 30, 2014
- Shawn Xavier Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB MANUFACTURING PROCESS AND STRUCTURE
- Publication number 20140008110
- Publication date Jan 9, 2014
- Apple Incl
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES
- Publication number 20130201615
- Publication date Aug 8, 2013
- Apple Inc.
- Shawn X. ARNOLD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES
- Publication number 20130201616
- Publication date Aug 8, 2013
- Apple Inc.
- Shawn X. ARNOLD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE
- Publication number 20130141861
- Publication date Jun 6, 2013
- Apple Inc.
- Gloria Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Mounting of Components Using Solder Paste Fiducials
- Publication number 20130125392
- Publication date May 23, 2013
- Dennis R. Pyper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RF SHIELDING FOR ELECTRONIC COMPONENTS
- Publication number 20130120957
- Publication date May 16, 2013
- Apple Inc.
- Christopher Matthew Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING TECHNIQUES
- Publication number 20130114228
- Publication date May 9, 2013
- Apple Inc.
- Nicholas G. Merz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT
- Publication number 20130063914
- Publication date Mar 14, 2013
- Apple Inc.
- Gloria Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board With Integral Radio-Frequency Shields
- Publication number 20120140423
- Publication date Jun 7, 2012
- Joseph Fisher, JR.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PART SUBSTRATE ASSEMBLIES FOR LOW PROFILE PORTABLE ELECTRONIC...
- Publication number 20120075817
- Publication date Mar 29, 2012
- Kyle H. Yeates
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES
- Publication number 20110255850
- Publication date Oct 20, 2011
- Richard Hung Minh Dinh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD COMPONENTS FOR ELECTRONIC DEVICES
- Publication number 20110255250
- Publication date Oct 20, 2011
- Richard Hung Minh Dinh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT
- Publication number 20110013373
- Publication date Jan 20, 2011
- Apple Inc.
- Gloria Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dennis R. Pyper

Person

Patents Grantslast 30 patents

Stacked printed circuit board packages

Low-profile space-efficient shielding for SIP module

Circuit substrate with embedded heat sink

Stacked circuit board architecture in an electronic device

Circuit substrate with embedded heat sink

Connector inserts and receptacle tongues formed using printed circu...

Microphone assembly having an acoustic leak path

Low-area overhead connectivity solutions to SIP module

Printed circuit board with compact groups of devices

Printed circuits with embedded strain gauges

Liquid-based pressure sensitive adhesive for grounding applications

Printed circuit board with integral radio-frequency shields

Antenna structures and shield layers on packaged wireless circuits

Electromagnetic interference shielding techniques

Three dimensional passive multi-component structures

Multi-part substrate assemblies for low profile portable electronic...

Systems and methods for providing vias through a modular component

Devices and methods for embedding semiconductors in printed circuit...

Three dimensional passive multi-component structures

Devices and methods for embedding semiconductors in printed circuit...

Printed circuit board with integral radio-frequency shields

Systems and methods for providing a system-on-a-substrate

Systems and methods for providing vias through a modular component

Multi-part substrate assemblies for low profile portable electronic...

Patents Applicationslast 30 patents

Circuit substrate with embedded heat sink

STACKED PRINTED CIRCUIT BOARD PACKAGES

STACKED CIRCUIT BOARD ARCHITECTURE IN AN ELECTRONIC DEVICE

MICROPHONE ASSEMBLY HAVING AN ACOUSTIC LEAK PATH

Printed Circuits With Embedded Strain Gauges

Circuit substrate with embedded heat sink

LOW-PROFILE SPACE-EFFICIENT SHIELDING FOR SIP MODULE

LOW-AREA OVERHEAD CONNECTIVITY SOLUTIONS TO SIP MODULE

HEEL FILLET CAPACITOR WITH NOISE REDUCTION

LOW AREA OVER-HEAD CONNECTIVITY SOLUTIONS TO SIP MODULE

CONNECTOR INSERTS AND RECEPTACLE TONGUES FORMED USING PRINTED CIRCU...

Liquid-Based Pressure Sensitive Adhesive for Grounding Applications

Printed Circuit Board With Integral Radio-Frequency Shields

DEVICES AND METHODS FOR EMBEDDING SEMICONDUCTORS IN PRINTED CIRCUIT...

Printed circuit board with compact groups of devices

BOARD ASSEMBLIES WITH MINIMIZED WARPAGE AND SYSTEMS AND METHODS FOR...

Antenna Structures and Shield Layers on Packaged Wireless Circuits

PCB MANUFACTURING PROCESS AND STRUCTURE

THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES

THREE DIMENSIONAL PASSIVE MULTI-COMPONENT STRUCTURES

SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE

Mounting of Components Using Solder Paste Fiducials

RF SHIELDING FOR ELECTRONIC COMPONENTS

ELECTROMAGNETIC INTERFERENCE SHIELDING TECHNIQUES

SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT

Printed Circuit Board With Integral Radio-Frequency Shields

MULTI-PART SUBSTRATE ASSEMBLIES FOR LOW PROFILE PORTABLE ELECTRONIC...

ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES

PRINTED CIRCUIT BOARD COMPONENTS FOR ELECTRONIC DEVICES

SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT