Denver Zhu

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with package-on-package and met...
- Patent number 8,207,015
- Issue date Jun 26, 2012
- Stats Chippac Ltd.
- Guo Qiang Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...
- Publication number 20110266664
- Publication date Nov 3, 2011
- Guo Qiang Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR