Deog-Soon Choi

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for providing electromagnetic interference (EMI...
- Patent number 10,468,356
- Issue date Nov 5, 2019
- Avago Technologies International Sales Pte. Limited
- Ah Ron Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for providing electromagnetic interference (EMI...
- Patent number 10,271,421
- Issue date Apr 23, 2019
- Avago Technologies International Sales Pte. Limited
- Bernhard Gebauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of providing compartment EMI shields on printed circuit boar...
- Patent number 10,264,666
- Issue date Apr 16, 2019
- Avago Technologies International Sales Pte. Limited
- Deog Soon Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing electromagnetic interference (EMI...
- Patent number 10,229,888
- Issue date Mar 12, 2019
- Avago Technologies International Sales Pte. Limited
- Ah Ron Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for providing electromagnetic interference (EMI...
- Patent number 10,178,757
- Issue date Jan 8, 2019
- Avago Technologies International Sales Pte. Limited
- Ah Ron Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with embedded side shield structures and method of fabricati...
- Patent number 10,163,808
- Issue date Dec 25, 2018
- Avago Technologies International Sales Pte. Limited
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit package with internal and external shielding
- Patent number 10,141,268
- Issue date Nov 27, 2018
- Avago Technologies International Sales Pte. Limited
- Domingo Figueredo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit package with segmented external shield to provide internal...
- Patent number 10,134,682
- Issue date Nov 20, 2018
- Avago Technologies International Sales Pte. Limited
- Nitesh Kumbhat
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Systems and methods for providing electromagnetic interference (EMI...
- Patent number 10,134,686
- Issue date Nov 20, 2018
- Avago Technologies International Sales Pte. Limited
- Ah Ron Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for providing electromagnetic interference (EMI...
- Patent number 10,076,023
- Issue date Sep 11, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Deog-Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a solder-on-pad structure
- Patent number 9,972,590
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Deog Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumped land grid array
- Patent number 9,972,592
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Ah Ron Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with external shield and back-spill barrier for protecting c...
- Patent number 9,974,181
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board (PCB) and PCB assembly having an encapsulatin...
- Patent number 9,907,169
- Issue date Feb 27, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with thermal via
- Patent number 9,693,445
- Issue date Jun 27, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Hyun Mo Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad for printed circuit board and semiconductor chip packag...
- Patent number 9,192,048
- Issue date Nov 17, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Jin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC ASSEMBLY AND A METHOD OF FORMING THEREOF
- Publication number 20200043821
- Publication date Feb 6, 2020
- Avago Technologies International Sales Pte. Limited
- Deog Soon Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...
- Publication number 20190181098
- Publication date Jun 13, 2019
- Avago Technologies International Sales Pte. Limited
- Ah Ron Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...
- Publication number 20180324940
- Publication date Nov 8, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Deog-Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...
- Publication number 20180254249
- Publication date Sep 6, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Ah Ron Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...
- Publication number 20180130755
- Publication date May 10, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Ah Ron Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...
- Publication number 20180098416
- Publication date Apr 5, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Deog-Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...
- Publication number 20180098417
- Publication date Apr 5, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Bernhard Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...
- Publication number 20180098418
- Publication date Apr 5, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Ah Ron Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD (PCB) AND PCB ASSEMBLY HAVING AN ENCAPSULATIN...
- Publication number 20180063951
- Publication date Mar 1, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROVIDING COMPARTMENT EMI SHIELDS ON PRINTED CIRCUIT BOAR...
- Publication number 20170367225
- Publication date Dec 21, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Deog Soon Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...
- Publication number 20170280561
- Publication date Sep 28, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGE WITH INTERNAL AND EXTERNAL SHIELDING
- Publication number 20170127581
- Publication date May 4, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Domingo Figueredo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT PACKAGE WITH TRENCH FEATURES TO PROVIDE INTERNAL SHIELDING...
- Publication number 20170117229
- Publication date Apr 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGE WITH BOND WIRES TO PROVIDE INTERNAL SHIELDING BETWE...
- Publication number 20170118877
- Publication date Apr 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT PACKAGE WITH SEGMENTED EXTERNAL SHIELD TO PROVIDE INTERNAL...
- Publication number 20170117230
- Publication date Apr 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH EMBEDDED SIDE SHIELD STRUCTURES AND METHOD OF FABRICATI...
- Publication number 20170118875
- Publication date Apr 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP MODULE
- Publication number 20170062352
- Publication date Mar 2, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Deog-Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH THERMAL VIA
- Publication number 20160227641
- Publication date Aug 4, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Hyun Mo Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE BY USING FLIP-CHIP BONDING
- Publication number 20160204077
- Publication date Jul 14, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Hyun Mo Ku
- H01 - BASIC ELECTRIC ELEMENTS

Deog-Soon Choi

Person

Patents Grantslast 30 patents

Systems and methods for providing electromagnetic interference (EMI...

Systems and methods for providing electromagnetic interference (EMI...

Method of providing compartment EMI shields on printed circuit boar...

Systems and methods for providing electromagnetic interference (EMI...

Systems and methods for providing electromagnetic interference (EMI...

Module with embedded side shield structures and method of fabricati...

Circuit package with internal and external shielding

Circuit package with segmented external shield to provide internal...

Systems and methods for providing electromagnetic interference (EMI...

Systems and methods for providing electromagnetic interference (EMI...

Semiconductor package having a solder-on-pad structure

Bumped land grid array

Module with external shield and back-spill barrier for protecting c...

Printed circuit board (PCB) and PCB assembly having an encapsulatin...

Printed circuit board with thermal via

Bonding pad for printed circuit board and semiconductor chip packag...

Patents Applicationslast 30 patents

ELECTRONIC ASSEMBLY AND A METHOD OF FORMING THEREOF

SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...

SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...

SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...

SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...

SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...

SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...

SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...

PRINTED CIRCUIT BOARD (PCB) AND PCB ASSEMBLY HAVING AN ENCAPSULATIN...

METHOD OF PROVIDING COMPARTMENT EMI SHIELDS ON PRINTED CIRCUIT BOAR...

MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...

CIRCUIT PACKAGE WITH INTERNAL AND EXTERNAL SHIELDING

CIRCUIT PACKAGE WITH TRENCH FEATURES TO PROVIDE INTERNAL SHIELDING...

CIRCUIT PACKAGE WITH BOND WIRES TO PROVIDE INTERNAL SHIELDING BETWE...

CIRCUIT PACKAGE WITH SEGMENTED EXTERNAL SHIELD TO PROVIDE INTERNAL...

MODULE WITH EMBEDDED SIDE SHIELD STRUCTURES AND METHOD OF FABRICATI...

SEMICONDUCTOR CHIP MODULE

PRINTED CIRCUIT BOARD WITH THERMAL VIA

METHOD FOR MANUFACTURING ELECTRONIC DEVICE BY USING FLIP-CHIP BONDING