DeokKyung Yang

Person

Incheon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method and device for reducing metal burrs when sawing semiconducto...
- Patent number 12,046,564
- Issue date Jul 23, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for reducing metal burrs when sawing semiconducto...
- Patent number 11,676,911
- Issue date Jun 13, 2023
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 11,652,088
- Issue date May 16, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 11,587,882
- Issue date Feb 21, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an integrated SiP module...
- Patent number 11,367,690
- Issue date Jun 21, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protrusion e-bar for 3D SiP
- Patent number 11,342,294
- Issue date May 24, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for reducing metal burrs when sawing semiconducto...
- Patent number 11,244,908
- Issue date Feb 8, 2022
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 11,189,598
- Issue date Nov 30, 2021
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,145,603
- Issue date Oct 12, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,024,585
- Issue date Jun 1, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 10,937,741
- Issue date Mar 2, 2021
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,797,024
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,797,039
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
- Patent number 10,790,268
- Issue date Sep 29, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an integrated SIP module...
- Patent number 10,700,011
- Issue date Jun 30, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protrusion E-bar for 3D SIP
- Patent number 10,636,756
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
- Patent number 10,636,774
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,636,765
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 10,468,384
- Issue date Nov 5, 2019
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,388,637
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Integrated circuit packaging system with molded laser via interpose...
- Patent number 10,083,903
- Issue date Sep 25, 2018
- STATS ChipPAC Pte. Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 9,997,468
- Issue date Jun 12, 2018
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer substrate designs for semiconductor packages
- Patent number 9,905,491
- Issue date Feb 27, 2018
- STATS ChipPAC Pte. Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with conductive pillars and met...
- Patent number 9,748,203
- Issue date Aug 29, 2017
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with molded laser via interpose...
- Patent number 9,385,066
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with package-on-package and met...
- Patent number 9,230,898
- Issue date Jan 5, 2016
- Stats Chippac Ltd.
- HanGil Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with connection structure and m...
- Patent number 9,202,715
- Issue date Dec 1, 2015
- Stats Chippac Ltd.
- YoungChul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of mitigating defects for semiconductor packages
- Patent number 9,184,067
- Issue date Nov 10, 2015
- Stats Chippac Ltd.
- KyungHwan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and Device for Reducing Metal Burrs When Sawing Semiconducto...
- Publication number 20230268289
- Publication date Aug 24, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20230154864
- Publication date May 18, 2023
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Reducing Metal Burrs When Sawing Semiconducto...
- Publication number 20220115332
- Publication date Apr 14, 2022
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Die Substrate,...
- Publication number 20220052025
- Publication date Feb 17, 2022
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20210151386
- Publication date May 20, 2021
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System-in-Package with Double-Sided Molding
- Publication number 20200402955
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-i...
- Publication number 20200373289
- Publication date Nov 26, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Integrated SIP Module...
- Publication number 20200286835
- Publication date Sep 10, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
- Publication number 20200219835
- Publication date Jul 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Integrated System-i...
- Publication number 20200219859
- Publication date Jul 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System-in-Package with Double-Sided Molding
- Publication number 20200219847
- Publication date Jul 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20200161252
- Publication date May 21, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Reducing Metal Burrs When Sawing Semiconducto...
- Publication number 20200144198
- Publication date May 7, 2020
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
- Publication number 20200013738
- Publication date Jan 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Die Substrate,...
- Publication number 20200006295
- Publication date Jan 2, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Die Substrate,...
- Publication number 20190088621
- Publication date Mar 21, 2019
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Integrated System-i...
- Publication number 20190074267
- Publication date Mar 7, 2019
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20180294236
- Publication date Oct 11, 2018
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20180294235
- Publication date Oct 11, 2018
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System -in-Package with Double-Sided Molding
- Publication number 20180269181
- Publication date Sep 20, 2018
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-i...
- Publication number 20180261569
- Publication date Sep 13, 2018
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Integrated SIP Module...
- Publication number 20180158779
- Publication date Jun 7, 2018
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-I...
- Publication number 20180158768
- Publication date Jun 7, 2018
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20160300799
- Publication date Oct 13, 2016
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...
- Publication number 20130154092
- Publication date Jun 20, 2013
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDE MOLD AND METHOD...
- Publication number 20130069240
- Publication date Mar 21, 2013
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF M...
- Publication number 20130070438
- Publication date Mar 21, 2013
- A Leam Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METH...
- Publication number 20120319286
- Publication date Dec 20, 2012
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED LASER VIA INTERPOSE...
- Publication number 20120319265
- Publication date Dec 20, 2012
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFA...
- Publication number 20120223435
- Publication date Sep 6, 2012
- A Leam Choi
- H01 - BASIC ELECTRIC ELEMENTS

DeokKyung Yang

Person

Patents Grantslast 30 patents

Method and device for reducing metal burrs when sawing semiconducto...

Semiconductor device and method of forming a 3D interposer system-i...

Method and device for reducing metal burrs when sawing semiconducto...

System-in-package with double-sided molding

Semiconductor device and method of forming embedded die substrate,...

Molded laser package with electromagnetic interference shield and m...

Semiconductor device and method of forming an integrated SiP module...

Semiconductor device and method of forming protrusion e-bar for 3D SiP

Method and device for reducing metal burrs when sawing semiconducto...

Semiconductor device and method of forming embedded die substrate,...

Integrated circuit packaging system with shielding and method of ma...

Integrated circuit packaging system with shielding and method of ma...

Molded laser package with electromagnetic interference shield and m...

System-in-package with double-sided molding

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor device and method of forming a 3D integrated system-i...

Semiconductor device and method of forming an integrated SIP module...

Semiconductor device and method of forming protrusion E-bar for 3D SIP

Semiconductor device and method of forming a 3D integrated system-i...

System-in-package with double-sided molding

Semiconductor device and method of forming embedded die substrate,...

Semiconductor device and method of forming a 3D interposer system-i...

Integrated circuit packaging system with molded laser via interpose...

Integrated circuit packaging system with shielding and method of ma...

Interposer substrate designs for semiconductor packages

Integrated circuit packaging system with conductive pillars and met...

Integrated circuit packaging system with molded laser via interpose...

Integrated circuit packaging system with package-on-package and met...

Integrated circuit packaging system with connection structure and m...

Methods of mitigating defects for semiconductor packages

Patents Applicationslast 30 patents

Method and Device for Reducing Metal Burrs When Sawing Semiconducto...

Molded Laser Package with Electromagnetic Interference Shield and M...

Method and Device for Reducing Metal Burrs When Sawing Semiconducto...

Semiconductor Device and Method of Forming Embedded Die Substrate,...

Molded Laser Package with Electromagnetic Interference Shield and M...

System-in-Package with Double-Sided Molding

Semiconductor Device and Method of Forming a 3D Interposer System-i...

Semiconductor Device and Method of Forming an Integrated SIP Module...

Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP

Semiconductor Device and Method of Forming a 3D Integrated System-i...

System-in-Package with Double-Sided Molding

Molded Laser Package with Electromagnetic Interference Shield and M...

Method and Device for Reducing Metal Burrs When Sawing Semiconducto...

Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP

Semiconductor Device and Method of Forming Embedded Die Substrate,...

Semiconductor Device and Method of Forming Embedded Die Substrate,...

Semiconductor Device and Method of Forming a 3D Integrated System-i...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

System -in-Package with Double-Sided Molding

Semiconductor Device and Method of Forming a 3D Interposer System-i...

Semiconductor Device and Method of Forming an Integrated SIP Module...

Semiconductor Device and Method of Forming a 3D Interposer System-I...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDE MOLD AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF M...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METH...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED LASER VIA INTERPOSE...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFA...