Dereje Agonafer

Person

Grand Prairie, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cavity plate and jet nozzle assemblies for use in cooling an electr...
- Patent number 6,431,260
- Issue date Aug 13, 2002
- International Business Machines Corporation
- Dereje Agonafer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isothermal heat sink with tiered cooling channels
- Patent number 6,337,794
- Issue date Jan 8, 2002
- International Business Machines Corporation
- Dereje Agonafer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended surface cooling for chip stack applications
- Patent number 5,719,745
- Issue date Feb 17, 1998
- International Business Machines Corporation
- Dereje Agonafer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air flow distribution in integrated circuit spot coolers
- Patent number 5,704,419
- Issue date Jan 6, 1998
- International Business Machines Corporation
- Dereje Agonafer
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Convertible heat exchanger for air or water cooling of electronic c...
- Patent number 5,482,113
- Issue date Jan 9, 1996
- International Business Machines Corporation
- Dereje Agonafer
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Convertible cooling module for air or water cooling of electronic c...
- Patent number 5,370,178
- Issue date Dec 6, 1994
- International Business Machines Corporation
- Dereje Agonafer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package cooling technique with liquid film spreading downwa...
- Patent number 4,757,370
- Issue date Jul 12, 1988
- International Business Machines Corp.
- Dereje Agonafer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAVITY PLATE AND JET NOZZLE ASSEMBLIES FOR USE IN COOLING AN ELECTR...
- Publication number 20020079088
- Publication date Jun 27, 2002
- International Business Machines Corporation
- Dereje Agonafer
- H01 - BASIC ELECTRIC ELEMENTS

Dereje Agonafer

Person

Patents Grantslast 30 patents

Cavity plate and jet nozzle assemblies for use in cooling an electr...

Isothermal heat sink with tiered cooling channels

Extended surface cooling for chip stack applications

Air flow distribution in integrated circuit spot coolers

Convertible heat exchanger for air or water cooling of electronic c...

Convertible cooling module for air or water cooling of electronic c...

Circuit package cooling technique with liquid film spreading downwa...

Patents Applicationslast 30 patents

CAVITY PLATE AND JET NOZZLE ASSEMBLIES FOR USE IN COOLING AN ELECTR...