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Derek B. Workman
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Noblesville, IN, US
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Patents Grants
last 30 patents
Information
Patent Grant
Radiopaque polymers for circuit board assembly
Patent number
7,790,814
Issue date
Sep 7, 2010
Delphi Technologies, Inc.
Rafil A. Basheer
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Dendritic polyol, cycloaliphatic epoxy resin and cationic initiator
Patent number
7,754,824
Issue date
Jul 13, 2010
Delphi Technologies, Inc.
Rafil A. Basheer
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Silica nanoparticles thermoset resin compositions
Patent number
7,498,197
Issue date
Mar 3, 2009
Delphi Technologies, Inc.
Rafil A. Basheer
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Underfill method
Patent number
7,331,106
Issue date
Feb 19, 2008
Delphi Technologies, Inc.
Derek B. Workman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic assembly including multiple substrates
Patent number
7,205,652
Issue date
Apr 17, 2007
Delphi Technologies, Inc.
M. Ray Fairchild
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic module with form in-place pedestal
Patent number
7,202,571
Issue date
Apr 10, 2007
Delphi Technologies, Inc.
Brian D. Thompson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Enhancement of underfill physical properties by the addition of the...
Patent number
7,119,449
Issue date
Oct 10, 2006
Delphi Technologies, Inc.
Derek B. Workman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
No-flow underfill process and material therefor
Patent number
6,943,058
Issue date
Sep 13, 2005
Delphi Technologies, Inc.
Arun K. Chaudhuri
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
No-flow underfill material and underfill method for flip chip devices
Patent number
6,660,560
Issue date
Dec 9, 2003
Delphi Technologies, Inc.
Arun K. Chaudhuri
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HYPERBRANCHED POLYMER AND CYCLOALIPHATIC EPOXY RESIN THERMOSETS
Publication number
20090082528
Publication date
Mar 26, 2009
Rafil A. Basheer
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
SILICA NANOPARTICLES THERMOSET RESIN COMPOSITIONS
Publication number
20080122118
Publication date
May 29, 2008
Rafil A. Basheer
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Devices with microjetted polymer standoffs
Publication number
20070235217
Publication date
Oct 11, 2007
Derek B. Workman
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Hyperbranched polymer and cycloaliphatic epoxy resin thermosets
Publication number
20060252892
Publication date
Nov 9, 2006
Rafil A. Basheer
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Radiopaque polymers for circuit board assembly
Publication number
20060222860
Publication date
Oct 5, 2006
Rafil A. Basheer
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Electronic assembly including multiple substrates
Publication number
20060214299
Publication date
Sep 28, 2006
M. Ray Fairchild
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Underfill method
Publication number
20060200985
Publication date
Sep 14, 2006
DELPHI TECHNOLOGIES, INC.
Derek B. Workman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of making a curable composition having low coefficient of t...
Publication number
20060199301
Publication date
Sep 7, 2006
Rafil A. Basheer
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Electronic module with form in-place pedestal
Publication number
20060033195
Publication date
Feb 16, 2006
Brian D. Thompson
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Enhancement of underfill physical properties by the addition of a t...
Publication number
20050122697
Publication date
Jun 9, 2005
Derek B. Workman
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Underfill method
Publication number
20050014313
Publication date
Jan 20, 2005
Derek B. Workman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
No-flow underfill process and material therefor
Publication number
20040185602
Publication date
Sep 23, 2004
Delphi Technologies, Inc.
Arun K. Chaudhuri
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
No-flow underfill material and underfill method for flip chip devices
Publication number
20030049411
Publication date
Mar 13, 2003
DELPHI TECHNOLOGIES,INC
Arun K. Chaudhuri
B32 - LAYERED PRODUCTS