Derek S. Swanson

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Heat conductive substrate for integrated circuit package
- Patent number 9,070,657
- Issue date Jun 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tim V. Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for configuring conductive elements for a semic...
- Patent number 8,754,518
- Issue date Jun 17, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
HEAT CONDUCTIVE SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE
- Publication number 20150097280
- Publication date Apr 9, 2015
- Tim V. Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED SEMICONDUCTOR DIE STACK
- Publication number 20150069624
- Publication date Mar 12, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tim V. Pham
- H01 - BASIC ELECTRIC ELEMENTS