Derrick Herron

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Utica, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Voiding control using solid solder preforms embedded in solder paste
- Patent number 10,537,030
- Issue date Jan 14, 2020
- Indium Corporation
- Zhenxi Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder pastes for providing high elasticity, low rigidity solder jo...
- Patent number 7,017,795
- Issue date Mar 28, 2006
- Indium Corporation of America
- Yan Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
VOIDING CONTROL USING SOLID SOLDER PREFORMS EMBEDDED IN SOLDER PASTE
- Publication number 20160057869
- Publication date Feb 25, 2016
- Indium Corporation
- Zhenxi Wei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTES FOR PROVIDING IMPACT RESISTANT, MECHANICALLY STABLE S...
- Publication number 20120248176
- Publication date Oct 4, 2012
- DERRICK Matthew HERRON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder pastes for providing high elasticity, low rigidity solder jo...
- Publication number 20050092819
- Publication date May 5, 2005
- Yan Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR