Membership
Tour
Register
Log in
Desmond Yok Rue Chong
Follow
Person
Singapore, SG
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Molded high density electronic packaging structure for high perform...
Patent number
7,361,995
Issue date
Apr 22, 2008
Xilinx, Inc.
Kim Yong Goh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Chip Scale Package and Method of Assembling the Same
Publication number
20080290509
Publication date
Nov 27, 2008
UNITED TEST AND ASSEMBLY CENTER
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS