Detelf Houdeau

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Chip module with heat insulation for incorporation into a chip card
- Patent number 6,072,698
- Issue date Jun 6, 2000
- Siemens Aktiengesellschaft
- Detelf Houdeau
- G06 - COMPUTING CALCULATING COUNTING