Devarajan Balaraman

Person

Apex, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged electronic devices having dielectric substrates with therm...
- Patent number 12,224,233
- Issue date Feb 11, 2025
- Wolfspeed, Inc.
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with increased power handling
- Patent number 12,224,218
- Issue date Feb 11, 2025
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 12,205,827
- Issue date Jan 21, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number D1056862
- Issue date Jan 7, 2025
- Wolfspeed, Inc.
- Geza Dezsi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 10,832,921
- Issue date Nov 10, 2020
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 10,304,697
- Issue date May 28, 2019
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 10,157,872
- Issue date Dec 18, 2018
- Amkor Technology, Inc.
- Greg Hames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 10,037,957
- Issue date Jul 31, 2018
- Amkor Technology, Inc.
- Greg Hames
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038055
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20240421029
- Publication date Dec 19, 2024
- Wolfspeed, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Beryllium Metallization
- Publication number 20240355738
- Publication date Oct 24, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Nitride Core-Shell Particle Die-Attach Material
- Publication number 20240282741
- Publication date Aug 22, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Die-Attach Process for Semiconductor Packaging
- Publication number 20240274514
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...
- Publication number 20240258217
- Publication date Aug 1, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Enhanced Power Semiconductor Package
- Publication number 20240243031
- Publication date Jul 18, 2024
- Wolfspeed, Inc.
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Core-Shell Particle Die-Attach Material
- Publication number 20240182757
- Publication date Jun 6, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGES WITH INCREASED POWER HANDLING
- Publication number 20230260861
- Publication date Aug 17, 2023
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES HAVING DIELECTRIC SUBSTRATES WITH THERM...
- Publication number 20220238426
- Publication date Jul 28, 2022
- Cree, Inc.
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20210043465
- Publication date Feb 11, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20190279882
- Publication date Sep 12, 2019
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20190109018
- Publication date Apr 11, 2019
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180323161
- Publication date Nov 8, 2018
- Amkor Technology, Inc.
- Greg Hames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180138138
- Publication date May 17, 2018
- Amkor Technology, Inc.
- Greg Hames
- H01 - BASIC ELECTRIC ELEMENTS

Devarajan Balaraman

Person

Patents Grantslast 30 patents

Packaged electronic devices having dielectric substrates with therm...

Semiconductor packages with increased power handling

Electronic device with top side pin array and manufacturing method...

Semiconductor package

Electronic device with top side pin array and manufacturing method...

Electronic device with top side pin array and manufacturing method...

Semiconductor device and method of manufacturing thereof

Semiconductor device and method of manufacturing thereof

Patents Applicationslast 30 patents

Submounts with Stud Protrusions for Semiconductor Packages

Semiconductor Package

Power Semiconductor Devices Including Beryllium Metallization

Metal Nitride Core-Shell Particle Die-Attach Material

Electroless Die-Attach Process for Semiconductor Packaging

SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...

Thermal Enhanced Power Semiconductor Package

Core-Shell Particle Die-Attach Material

SEMICONDUCTOR PACKAGES WITH INCREASED POWER HANDLING

PACKAGED ELECTRONIC DEVICES HAVING DIELECTRIC SUBSTRATES WITH THERM...

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF