Devika Sarkar Grant

Person

Rensselaer, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio buried power rail metallization
- Patent number 12,148,699
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal residue and liner cleanse for post-subtractive etch
- Patent number 12,046,511
- Issue date Jul 23, 2024
- International Business Machines Corporation
- Devika Sarkar Grant
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTORS WITH VIA-TO-BACKSIDE POWER RAIL SPACERS
- Publication number 20240105554
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION
- Publication number 20230402378
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLEVEL VIA FOR STACKED FIELD-EFFECT TRANSISTOR DEVICE
- Publication number 20230369218
- Publication date Nov 16, 2023
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA TO BACKSIDE POWER RAIL THROUGH ACTIVE REGION
- Publication number 20230369220
- Publication date Nov 16, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT INTEGRATION FOR TRANSISTORS
- Publication number 20230268389
- Publication date Aug 24, 2023
- International Business Machines Corporation
- Nikhil Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT INTERCONNECT STRUCTURE
- Publication number 20230207330
- Publication date Jun 29, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL RESIDUE AND LINER CLEANSE FOR POST-SUBTRACTIVE ETCH
- Publication number 20230163029
- Publication date May 25, 2023
- International Business Machines Corporation
- Devika Sarkar Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS
- Publication number 20230163039
- Publication date May 25, 2023
- International Business Machines Corporation
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED POWER RAIL AFTER REPLACEMENT METAL GATE
- Publication number 20230163020
- Publication date May 25, 2023
- International Business Machines Corporation
- Devika Sarkar Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEVELING DIELECTRIC SURFACES FOR CONTACT FORMATION WITH EMBEDDED ME...
- Publication number 20230146034
- Publication date May 11, 2023
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER DIELECTRIC STACK FOR DAMASCENE TOP-VIA INTEGRATION
- Publication number 20230055600
- Publication date Feb 23, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS

Devika Sarkar Grant

Person

Patents Grantslast 30 patents

High aspect ratio buried power rail metallization

Selective metal residue and liner cleanse for post-subtractive etch

Patents Applicationslast 30 patents

TRANSISTORS WITH VIA-TO-BACKSIDE POWER RAIL SPACERS

HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION

INTERLEVEL VIA FOR STACKED FIELD-EFFECT TRANSISTOR DEVICE

VIA TO BACKSIDE POWER RAIL THROUGH ACTIVE REGION

SELF-ALIGNED BACKSIDE CONTACT INTEGRATION FOR TRANSISTORS

CIRCUIT INTERCONNECT STRUCTURE

SELECTIVE METAL RESIDUE AND LINER CLEANSE FOR POST-SUBTRACTIVE ETCH

DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS

BURIED POWER RAIL AFTER REPLACEMENT METAL GATE

LEVELING DIELECTRIC SURFACES FOR CONTACT FORMATION WITH EMBEDDED ME...

MULTILAYER DIELECTRIC STACK FOR DAMASCENE TOP-VIA INTEGRATION