Devika Sil

Person

Rensselaer, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Forming high carbon content flowable dielectric film with low proce...
- Patent number 11,756,786
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large grain copper interconnect lines for MRAM
- Patent number 11,309,216
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects including dual-metal vias
- Patent number 11,302,637
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Balasubramanian S. Pranatharthi Haran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM devices containing a harden gap fill dielectric material
- Patent number 11,114,606
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect with self-forming wrap-all-around barrier layer
- Patent number 10,978,342
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTS INCLUDING DUAL-METAL VIAS
- Publication number 20220051976
- Publication date Feb 17, 2022
- International Business Machines Corporation
- Balasubramanian S. Pranatharthi Haran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Metal Contamination Removal from BEOL Wafers
- Publication number 20210296118
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Devika Sil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE GRAIN COPPER INTERCONNECT LINES FOR MRAM
- Publication number 20210233812
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICES CONTAINING A HARDEN GAP FILL DIELECTRIC MATERIAL
- Publication number 20210091302
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP CURING OF DIELECTRIC FILMS IN INTEGRATED CIRCUITS
- Publication number 20200388488
- Publication date Dec 10, 2020
- International Business Machines Corporation
- Devika Sil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ION IMPLANTATION ASSISTED CURING FOR FLOWABLE POROUS DIELECTRICS
- Publication number 20200388531
- Publication date Dec 10, 2020
- International Business Machines Corporation
- Devika Sil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect with Self-Forming Wrap-All-Around Barrier Layer
- Publication number 20200243383
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING HIGH CARBON CONTENT FLOWABLE DIELECTRIC FILM WITH LOW PROCE...
- Publication number 20200234949
- Publication date Jul 23, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Forming high carbon content flowable dielectric film with low proce...

Large grain copper interconnect lines for MRAM

Interconnects including dual-metal vias

MRAM devices containing a harden gap fill dielectric material

Interconnect with self-forming wrap-all-around barrier layer

Patents Applicationslast 30 patents

INTERCONNECTS INCLUDING DUAL-METAL VIAS

Embedded Metal Contamination Removal from BEOL Wafers

LARGE GRAIN COPPER INTERCONNECT LINES FOR MRAM

MRAM DEVICES CONTAINING A HARDEN GAP FILL DIELECTRIC MATERIAL

BOTTOM-UP CURING OF DIELECTRIC FILMS IN INTEGRATED CIRCUITS

ION IMPLANTATION ASSISTED CURING FOR FLOWABLE POROUS DIELECTRICS

Interconnect with Self-Forming Wrap-All-Around Barrier Layer

FORMING HIGH CARBON CONTENT FLOWABLE DIELECTRIC FILM WITH LOW PROCE...