Devin Martin

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Microfluidic system or device and method of manufacturing a microfl...
- Patent number 11,559,974
- Issue date Jan 24, 2023
- Disco Corporation
- Karl Heinz Priewasser
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Device chip and method of manufacturing device chip
- Patent number 10,978,347
- Issue date Apr 13, 2021
- Disco Corporation
- Devin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device chip manufacturing method
- Patent number 9,206,037
- Issue date Dec 8, 2015
- Disco Corporation
- Aris Bernales
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Processing method for bump-included device wafer
- Patent number 8,580,655
- Issue date Nov 12, 2013
- Disco Corporation
- Devin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing device wafer
- Patent number 8,461,019
- Issue date Jun 11, 2013
- Disco Corporation
- Devin Martin
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
DEVICE CHIP AND METHOD OF MANUFACTURING DEVICE CHIP
- Publication number 20210082760
- Publication date Mar 18, 2021
- Disco Corporation
- Devin MARTIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFLUIDIC SYSTEM OR DEVICE AND METHOD OF MANUFACTURING A MICROFL...
- Publication number 20190091649
- Publication date Mar 28, 2019
- Disco Corporation
- Karl Heinz Priewasser
- B32 - LAYERED PRODUCTS
Information Patent Application
MEMS DEVICE CHIP MANUFACTURING METHOD
- Publication number 20150251902
- Publication date Sep 10, 2015
- Disco Corporation
- Aris Bernales
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESSING METHOD FOR BUMP-INCLUDED DEVICE WAFER
- Publication number 20130230966
- Publication date Sep 5, 2013
- Disco Corporation
- Devin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING DEVICE WAFER
- Publication number 20130023107
- Publication date Jan 24, 2013
- Disco Corporation
- Devin Martin
- H01 - BASIC ELECTRIC ELEMENTS