Dewali Ray

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure patterning
- Patent number 11,011,521
- Issue date May 18, 2021
- Micron Technology, Inc.
- Sevim Korkmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of a capacitor using a sacrificial layer
- Patent number 10,964,475
- Issue date Mar 30, 2021
- Micron Technology, Inc.
- Devesh Dadhich Shreeram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pass-through interconnect structure for microelectronic dies and as...
- Patent number 10,020,287
- Issue date Jul 10, 2018
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pass-through 3D interconnect for microelectronic dies and associate...
- Patent number 9,209,158
- Issue date Dec 8, 2015
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing semiconductor substrates, electrostatic carri...
- Patent number 8,929,052
- Issue date Jan 6, 2015
- Micron Technology, Inc.
- Dewali Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing semiconductor substrates, electrostatic carri...
- Patent number 8,503,156
- Issue date Aug 6, 2013
- Micron Technology, Inc.
- Dewali Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pass-through 3D interconnect for microelectronic dies and associate...
- Patent number 8,084,854
- Issue date Dec 27, 2011
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing substrates, electrostatic carriers for retain...
- Patent number 7,989,022
- Issue date Aug 2, 2011
- Micron Technology, Inc.
- Dewali Ray
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE PATTERNING
- Publication number 20200381437
- Publication date Dec 3, 2020
- Micron Technology, Inc.
- Sevim Korkmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF A CAPACITOR USING A SACRIFICIAL LAYER
- Publication number 20200243258
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Devesh Dadhich Shreeram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASS-THROUGH INTERCONNECT STRUCTURE FOR MICROELECTRONIC DIES AND AS...
- Publication number 20160086926
- Publication date Mar 24, 2016
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Processing Semiconductor Substrates, Electrostatic Carri...
- Publication number 20130276985
- Publication date Oct 24, 2013
- Dewali Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASS-THROUGH 3D INTERCONNECT FOR MICROELECTRONIC DIES AND ASSOCIATE...
- Publication number 20120094443
- Publication date Apr 19, 2012
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Processing Semiconductor Substrates, Electrostatic Carri...
- Publication number 20110253042
- Publication date Oct 20, 2011
- Micron Technology, Inc.
- Dewali Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASS-THROUGH 3D INTERCONNECT FOR MICROELECTRONIC DIES AND ASSOCIATE...
- Publication number 20090166846
- Publication date Jul 2, 2009
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Processing Substrates, Electrostatic Carriers for Retain...
- Publication number 20090022901
- Publication date Jan 22, 2009
- Dewali Ray
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor structure patterning

Formation of a capacitor using a sacrificial layer

Pass-through interconnect structure for microelectronic dies and as...

Pass-through 3D interconnect for microelectronic dies and associate...

Methods of processing semiconductor substrates, electrostatic carri...

Methods of processing semiconductor substrates, electrostatic carri...

Pass-through 3D interconnect for microelectronic dies and associate...

Methods of processing substrates, electrostatic carriers for retain...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE PATTERNING

FORMATION OF A CAPACITOR USING A SACRIFICIAL LAYER

PASS-THROUGH INTERCONNECT STRUCTURE FOR MICROELECTRONIC DIES AND AS...

Methods of Processing Semiconductor Substrates, Electrostatic Carri...

PASS-THROUGH 3D INTERCONNECT FOR MICROELECTRONIC DIES AND ASSOCIATE...

Methods of Processing Semiconductor Substrates, Electrostatic Carri...

PASS-THROUGH 3D INTERCONNECT FOR MICROELECTRONIC DIES AND ASSOCIATE...

Methods of Processing Substrates, Electrostatic Carriers for Retain...