Dewen Tian

Person

  • Weifang, Shandong, CN

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGING METHOD FOR CIRCUIT UNITS

    • Publication number 20220406619
    • Publication date Dec 22, 2022
    • WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
    • Haisheng Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGING STRUCTURE FOR CIRCUIT UNITS

    • Publication number 20220408549
    • Publication date Dec 22, 2022
    • WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
    • Haisheng Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR PACKAGING CHIP

    • Publication number 20220367209
    • Publication date Nov 17, 2022
    • WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
    • Baoguan Yin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHIELDING PROCESS FOR SIP PACKAGING

    • Publication number 20220254731
    • Publication date Aug 11, 2022
    • WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
    • Juncheng Guo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROMAGNETIC SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREO...

    • Publication number 20220248573
    • Publication date Aug 4, 2022
    • WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
    • Kaiwei Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR DETECTING COVERAGE RATE OF INTERMETALLIC COMPOUND

    • Publication number 20220236195
    • Publication date Jul 28, 2022
    • WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
    • Dingguo Zhong
    • G01 - MEASURING TESTING