Dewen TIAN

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding with liquid phase solder
- Patent number 10,014,272
- Issue date Jul 3, 2018
- ASM Technology Singapore Pte. Ltd.
- Dewen Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad assessment for wire bonding
- Patent number 8,657,180
- Issue date Feb 25, 2014
- ASM Technology Singapore Pte. Ltd.
- Ming Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING WITH LIQUID PHASE SOLDER
- Publication number 20160336292
- Publication date Nov 17, 2016
- ASM Technology Singapore Pte Ltd
- Dewen TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD ASSESSMENT FOR WIRE BONDING
- Publication number 20130327812
- Publication date Dec 12, 2013
- Ming LI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR