Dexin Liang

Person

Freemont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of packaging an integrated circuit and methods of forming a...
- Patent number RE42457
- Issue date Jun 14, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lily Zhao
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Integrated circuit package, ball-grid array integrated circuit package
- Patent number RE42332
- Issue date May 10, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lily Zhao
- 257 - Active solid-state devices
Information Patent Grant
Integrated circuit package, ball-grid array integrated circuit package
- Patent number 6,630,737
- Issue date Oct 7, 2003
- Koninklijke Philips Electronics N.V.
- Lily Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit device with integral decoupling capacitor
- Patent number 6,222,260
- Issue date Apr 24, 2001
- VLSI Technology, Inc.
- Dexin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging an integrated circuit and methods of forming a...
- Patent number 6,207,476
- Issue date Mar 27, 2001
- VLSI Technology, Inc.
- Lily Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for ball grid array (BGA) package
- Patent number 5,972,734
- Issue date Oct 26, 1999
- LSI Logic Corporation
- Karla Y. Carichner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anodized aluminum substrate having increased breakdown voltage
- Patent number 5,688,606
- Issue date Nov 18, 1997
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic integrated circuit mounted on circuit board with so...
- Patent number 5,639,696
- Issue date Jun 17, 1997
- LSI Logic Corporation
- Dexin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anodized aluminum substrate having increased breakdown voltage
- Patent number 5,534,356
- Issue date Jul 9, 1996
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamfered electronic package component
- Patent number 5,455,386
- Issue date Oct 3, 1995
- Olin Corporation
- George A. Brathwaite
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip electronic package module utilizing an adhesive sheet
- Patent number 5,360,942
- Issue date Nov 1, 1994
- Olin Corporation
- Paul R. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having controlled epoxy flow
- Patent number 5,239,131
- Issue date Aug 24, 1993
- Olin Corporation
- Paul R. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE, BALL-GRID ARRAY INTEGRATED CIRCUIT PACK...
- Publication number 20010015497
- Publication date Aug 23, 2001
- LILY ZHAO
- H01 - BASIC ELECTRIC ELEMENTS

Dexin Liang

Person

Patents Grantslast 30 patents

Methods of packaging an integrated circuit and methods of forming a...

Integrated circuit package, ball-grid array integrated circuit package

Integrated circuit package, ball-grid array integrated circuit package

Integrated circuit device with integral decoupling capacitor

Methods of packaging an integrated circuit and methods of forming a...

Interposer for ball grid array (BGA) package

Anodized aluminum substrate having increased breakdown voltage

Microelectronic integrated circuit mounted on circuit board with so...

Anodized aluminum substrate having increased breakdown voltage

Chamfered electronic package component

Multi-chip electronic package module utilizing an adhesive sheet

Electronic package having controlled epoxy flow

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE, BALL-GRID ARRAY INTEGRATED CIRCUIT PACK...