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Deyan CHEN
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Shanghai, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor structure and method for forming the same
Patent number
11,545,396
Issue date
Jan 3, 2023
Semiconductor Manufacturing International (Shanghai) Corporation
Deyan Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LDMOS device and manufacturing method thereof
Patent number
11,121,252
Issue date
Sep 14, 2021
Semiconductor Manufacturing (Beijing) Intel Corporation
Deyan Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
CMOS image sensor
Patent number
10,340,304
Issue date
Jul 2, 2019
Semiconductor Manufacturing International (Shanghai) Corporation
Dae-Sub Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
CMOS image sensor and fabrication method thereof
Patent number
10,038,027
Issue date
Jul 31, 2018
Semiconductor Manufacturing International (Shanghai) Corporation
Dae-Sub Jung
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LDMOS DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20210376145
Publication date
Dec 2, 2021
Semiconductor Manufacturing International (Beijing) Corporation
Deyan Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20210028065
Publication date
Jan 28, 2021
Semiconductor Manufacturing International (Shanghai) Corporation
Deyan CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LDMOS DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20200273989
Publication date
Aug 27, 2020
Semiconductor Manufacturing International (Beijing) Corporation
Deyan Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CMOS IMAGE SENSOR
Publication number
20180308893
Publication date
Oct 25, 2018
Semiconductor Manufacturing International (Shanghai) Corporation
Dae-Sub JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CMOS IMAGE SENSOR AND FABRICATION METHOD THEREOF
Publication number
20170200758
Publication date
Jul 13, 2017
Semiconductor Manufacturing International (Beijing)
Dae-Sub JUNG
H01 - BASIC ELECTRIC ELEMENTS