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Patents Grantslast 30 patents

Information Patent Grant
Image sensor packaging method, image sensor packaging structure, an...
- Patent number 11,282,879
- Issue date Mar 22, 2022
- Inno-Pach Technology Pte Ltd.
- Liping Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and device with packaged chips
- Patent number 10,937,767
- Issue date Mar 2, 2021
- Inno-Pach Technology Pte Ltd.
- Wanning Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for packaging same
- Patent number 10,777,718
- Issue date Sep 15, 2020
- Inno-Pach Technology Pte Ltd.
- Deze Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging method, image sensor package and lens module
- Patent number 10,727,260
- Issue date Jul 28, 2020
- Inno-Pach Technology Pte Ltd.
- Liping Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL SENSOR DEVICE AND PACKAGING METHOD THEREOF
- Publication number 20240113248
- Publication date Apr 4, 2024
- OIP Technology Pte Ltd
- Deze YU
- G01 - MEASURING TESTING
Information Patent Application
DRIVER CHIP, PACKAGING METHOD FOR OPTICAL FILTER STRUCTURE, OPTICAL...
- Publication number 20240061084
- Publication date Feb 22, 2024
- OIP Technology Pte Ltd
- Deze YU
- G02 - OPTICS
Information Patent Application
IMAGE SENSOR PACKAGING METHOD, IMAGE SENSOR PACKAGING STRUCTURE, AN...
- Publication number 20200343284
- Publication date Oct 29, 2020
- INNO-PACH TECHNOLOGY PTE LTD
- Liping CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR PACKAGING SAME
- Publication number 20200119243
- Publication date Apr 16, 2020
- INNO-PACH TECHNOLOGY PTE LTD
- Deze YU
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CHIP PACKAGING METHOD AND DEVICE WITH PACKAGED CHIPS
- Publication number 20190385986
- Publication date Dec 19, 2019
- INNO-PACH TECHNOLOGY PTE LTD
- Wanning ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING METHOD, IMAGE SENSOR PACKAGE AND LENS MODULE
- Publication number 20190123081
- Publication date Apr 25, 2019
- INNO-PACH TECHNOLOGY PTE LTD
- Liping CHANG
- H01 - BASIC ELECTRIC ELEMENTS